Packaged micro movable device and method for making the same

• US 20090139328A1
• Filed: 02/27/2008
• Published: 06/04/2009
• Est. Priority Date: 02/28/2007
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited, Fujitsu Media Devices Limited (Fujitsu Limited)
• Original Assignee: Fujitsu Limited, Fujitsu Media Devices Limited (Fujitsu Limited)
• Inventors: Yamaji, Takayuki, Inoue, Hiroaki, Katsuki, Takashi, Ishikawa, Hiroshi, Nakazawa, Fumihiko
• Application Number:
  US12/071,862
• Publication Number:
  US 20090139328A1
• Time in Patent Office: Days
• US Class Current: 73/514.20
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

A method is provided for making packaged micro-devices each including a micro movable element, a first packaging member formed with a recess, and a second packaging member formed with another recess. The micro movable element has a movable part. In accordance with the method, a device wafer is prepared for forming a plurality of micromovable elements. A first packaging wafer, formed with a plurality of recesses corresponding in position to the movable parts of the respective movable elements, is bonded to one surface of the device wafer. A second packaging wafer, formed with a plurality of recesses, is bonded to the other surface of the device wafer. The resulting laminate assembly is cut into separate products.

Claims

1. A method for making packaged micro-devices each comprising a micro movable element having a movable part, a first packaging member formed with a first recess corresponding in position to the movable part, and a second packaging member formed with a second recess corresponding in position to the movable part, the method comprising:

a first bonding step for bonding a first packaging wafer to a device wafer, the first packaging wafer being formed with a plurality of first recesses, the device wafer used for forming a plurality of micro movable elements and including a first surface and a second surface opposite to the first surface, the bonding of the first packaging wafer being performed with respect to the first surface of the device wafer;

a second bonding step for bonding a second packaging wafer to the second surface of the device wafer, the second packaging wafer being formed with a plurality of second recesses; and

a dicing step for cutting a laminate assembly including the device wafer, the first packaging wafer and the second packaging wafer.

2. The method according to claim 1, wherein each of the micro movable elements further includes, in addition to the movable part, a stationary part and a connecting part for connecting the movable part to the stationary part, the movable part being swingable.

3. The method according to claim 1, wherein each of the micro movable elements serves as an angular velocity sensor or an acceleration sensor.

4. The method according to claim 1, further comprising an etching processing step performed before the first bonding step, wherein the the device wafer has a laminate structure including a first layer including said first surface, a second layer including said second surface, and an intermediate layer between the first and the second layers, wherein the etching processing step comprises etching of the first layer by using a mask pattern as a mask.

5. The method according to claim 4, further comprising an additional etching processing step performed after the first bonding step and before the second bonding step, wherein the additional etching processing step comprises etching of the second layer by using a mask pattern as a mask.

6. The method according to claim 1, wherein each of the micro movable elements includes a terminal portion, the first packaging member including an electroconductive portion extending through the first packaging member to be connected with the terminal portion.

7. The method according to claim 6, wherein the electroconductive portion is made in the first packaging member before the first bonding step is performed.

8. The method according to claim 6, wherein the electroconductive portion is made in the first packaging member after the first bonding step is performed.

9. The method according to claim 1, wherein at least one of the first bonding step and the second bonding step is performed by one of an anodic bonding method, a direct bonding method, a room-temperature bonding method or an eutectic bonding method.

10. The method according to claim 1, wherein one of a border between the device wafer and the first packaging wafer and a border between the device wafer and the second packaging wafer is provided with an insulation film.

11. The method according to claim 1, wherein the first recesses are formed by DRIE, anisotropic wet etching or isotropic wet etching.

12. The method according to claim 1, wherein the second recesses are formed by DRIE, anisotropic wet etching or isotropic wet etching.

13. A packaged micro-device comprising:

a micro movable element including a movable part;

a first packaging member including a first recess corresponding in position to the movable part; and

a second packaging member including a second recess corresponding in position to the movable part.