×

DUPLEX TOUCH PANEL

  • US 20090140987A1
  • Filed: 12/04/2007
  • Published: 06/04/2009
  • Est. Priority Date: 12/04/2007
  • Status: Abandoned Application
First Claim
Patent Images

1. A duplex touch panel comprising:

  • a capacitive touch panel unit;

    a resistive touch panel unit which is overlapped to the capacitive touch panel unit to be formed as a plate body;

    a signal processing unit received sensing signals from the capacitive touch panel unit and the resistive touch panel unit;

    where the sensing signals are inputted form a touch operation on the touch panel;

    the signal processing unit having at least one signal determination loop for determining that the sensing signals are from the capacitive touch panel unit or the resistive touch panel unit so as to determine a predetermined signal processing mode and thus performed a predetermined signal processing operation;

    a surface layer being a flexible highly transparent insulated thin film;

    a first axis sensing layer being a transparent film with good conductivity;

    the first axis sensing layer having a plurality of first axis sensing traces which are parallel; and

    ends of each trace having respective joints;

    an insulation layer being a transparent insulated film layer;

    a second axis sensing layer being a transparent film with good conductivity;

    the second axis sensing layer having a plurality of second axis sensing traces which are parallel; and

    ends of each trace having respective joints;

    a base substrate being a flexible highly transparent insulated film; and

    a first signal output wire bank having a plurality of conductive paths;

    wherein the panel, the first axis sensing layer, the second axis sensing layer, the base substrate and the first signal output wire bank are glued together sequentially as a transparent plate like body;

    the first axis sensing traces and second axis sensing traces are arranged along different vertical directions so as to form as a matrix;

    the joints of the first axis sensing layer and second axis sensing layer are connected to silver conductive wires at edges of the base substrates and are connected to the first signal output wire bank so that signals from the first axis sensing layer and second axis sensing layer are transferred to a signal processing unit through the first signal output wire bank.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×