TOUCH SCREEN, TOUCH PANEL AND MANUFACTURING METHOD THEREOF

• US 20090140990A1
• Filed: 03/21/2008
• Published: 06/04/2009
• Est. Priority Date: 11/30/2007
• Status: Abandoned Application

• Current Assignee: Delta Electronics Incorporated
• Original Assignee: Delta Electronics Incorporated
• Inventors: Chen, Yang-Lin, Chang, Sean, Chang, Chii-How
• Application Number:
  US12/053,335
• Publication Number:
  US 20090140990A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 2203/04113 Peripheral electrode pattern in resistive digitisers, i.e. electrodes at the periphery of the resistive sheet are shaped in patterns enhancing linearity of induced field
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0444 using a single conductive element covering the whole sensing surface, e.g. by sensing the electrical current flowing at the corners

Abstract

A touch panel includes a substrate, a conductive circuit layer, a resistive layer and a dielectric layer. The substrate has a touch area and a peripheral area surrounding the touch area. The conductive circuit layer is formed on the peripheral area of the substrate. The resistive layer covers the conductive circuit layer and the touch area of the substrate. The dielectric layer is formed on the resistive layer. The conductive circuit layer includes a plurality of signal terminals disposed on corner surfaces of the substrate as the corner electrodes of the conductive circuit layer.

Claims

1. A touch panel comprising:

a substrate having a touch area and a peripheral area;

a conductive circuit layer formed on the peripheral area of the substrate;

a resistive layer formed on the conductive circuit layer and the touch area of the substrate; and

a dielectric layer formed on the resistive layer or a portion of the resistive layer located on the touch area.

2. The touch panel according to claim 1, wherein the conductive circuit layer comprises a plurality of signal terminals disposed on corner surfaces of the substrate to serve as corner electrodes of the conductive circuit layer.

3. The touch panel according to claim 1, wherein the substrate is a glass substrate or a plastic substrate.

4. The touch panel according to claim 1, wherein a material of the conductive circuit layer comprises copper or silver glue.

5. The touch panel according to claim 1, wherein the conductive circuit layer comprises discontinuous electrodes.

6. The touch panel according to claim 1, wherein a material of the resistive layer comprises a transparent conductive material.

7. The touch panel according to claim 6, wherein the transparent conductive material comprises indium tin oxide (ITO), indium zinc oxide (IZO), aluminum-doped zinc oxide (AZO), tin oxide (SnO,SnO₂), zinc gallium oxide or zinc oxide.

8. The touch panel according to claim 1, wherein the dielectric layer at least comprises an anti-reflective layer and/or a hardening layer.

9. The touch panel according to claim 8, wherein a material of the anti-reflective layer comprises silicon oxide, silicon nitride or silicon nitrogen oxide, niobium oxide, titanium oxide, aluminum oxide, aluminum nitride, tantalum oxide, zirconium oxide, magnesium oxide or Cryolite (Na₃AlF₆).

10. The touch panel according to claim 1, further comprising:

a protective layer formed on a portion of the dielectric layer on the peripheral area or a portion of the resistive layer on the peripheral area.

11. The touch panel according to claim 10, wherein a material of the protective layer comprises epoxy, acrylic glue or silicon.

12. A touch screen comprising:

a touch panel comprising;

a substrate having a touch area and a peripheral area,

a conductive circuit layer formed on the peripheral area of the substrate,

a resistive layer formed on the conductive circuit layer and the touch area of the substrate, and

a dielectric layer formed on the resistive layer or a portion of the resistive layer located on the touch area; and

an external circuit for applying voltage to the touch panel and receiving current from the touch panel.

13. The touch screen according to claim 12, wherein the dielectric layer at least comprises an anti-reflective layer and/or a hardening layer.

14. The touch screen according to claim 13, wherein a material of the anti-reflective layer comprises silicon oxide, silicon nitride or silicon nitrogen oxide, niobium oxide, titanium oxide, aluminum oxide, aluminum nitride, tantalum oxide, zirconium oxide, magnesium oxide or cryolite (Na₃AlF₆).

15. A manufacturing method of a touch screen comprising steps of:

providing a substrate having a touch area and a peripheral area;

forming a conductive circuit layer on the peripheral area of the substrate;

forming a resistive layer on the conductive circuit layer and the touch area of the substrate; and

forming a dielectric layer on the resistive layer or a portion of the resistive layer located on the touch area.

16. The method according to claim 15, wherein the conductive circuit layer comprises discontinuous electrodes and a plurality of signal terminals disposed on corner surfaces of the substrate to serve as corner electrodes of the conductive circuit layer.

17. The method according to claim 15, wherein the conductive circuit layer is formed on the substrate by coating, printing, adhering or deposition.

18. The method according to claim 15, wherein the dielectric layer at least comprises an anti-reflective layer and/or a hardening layer, and a material of the anti-reflective layer comprises silicon oxide, silicon nitride, silicon nitrogen oxide, niobium oxide, titanium oxide, aluminum oxide, aluminum nitride, tantalum oxide, zirconium oxide, magnesium oxide or cryolite (Na₃AlF₆).

19. The method according to claim 15, further comprising a step of:

forming a protective layer on a portion of the dielectric layer located on the peripheral area or a portion of the resistive layer located on the peripheral area, wherein a material of the protective layer comprises epoxy, acrylic glue or silicon.

20. The method according to claim 15, wherein the steps of forming the resistive layer and the dielectric layer are performed by one deposition apparatus.