Semiconductor Devices and Methods of Manufacture Thereof
First Claim
1. A capacitor plate, comprising:
- a plurality of first parallel conductive members;
a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members;
a first base member coupled to an end of the plurality of first parallel conductive members;
a second base member coupled to an end of the plurality of second parallel conductive members; and
a connecting member disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member comprises at least one elongated via.
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Accused Products
Abstract
Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a capacitor plate includes a plurality of first parallel conductive members, and a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members. A first base member is coupled to an end of the plurality of first parallel conductive members, and a second base member is coupled to an end of the plurality of second parallel conductive members. A connecting member is disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member includes at least one elongated via.
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Citations
25 Claims
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1. A capacitor plate, comprising:
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a plurality of first parallel conductive members; a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members; a first base member coupled to an end of the plurality of first parallel conductive members; a second base member coupled to an end of the plurality of second parallel conductive members; and a connecting member disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member comprises at least one elongated via. - View Dependent Claims (2, 3, 4, 5)
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6. A capacitor, comprising:
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a first plate; a second plate; and an insulating material disposed between the first plate and the second plate, wherein the first plate and the second plate each comprise;
a plurality of first parallel conductive members;
a plurality of second parallel conductive members disposed over the plurality of first parallel conductive members;
a first base member coupled to an end of at least some of the plurality of first parallel conductive members;
a second base member coupled to an end of at least some of the plurality of second parallel conductive members; and
a connecting member disposed between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein the connecting member comprises at least one elongated via. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor device, comprising:
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a workpiece; a plurality of first parallel conductive members disposed over the workpiece, the plurality of first parallel conductive members having a first end and a second end; a connecting member disposed over and coupled at least to the plurality of first parallel conductive members, the connecting members comprising at least one elongated via; a plurality of second parallel conductive members disposed over and coupled to the connecting members, the plurality of second parallel conductive members having a first end and a second end; a first base member coupled to the first end of every other of the plurality of first parallel conductive members, the first base member electrically coupling an alternating plurality of first parallel conductive members together; a second base member coupled to the second end of the plurality of first parallel conductive members not connected to the first base member, the second base member electrically coupling an alternating plurality of first parallel conductive members together; a third base member coupled to the first end of every other of the plurality of second parallel conductive members, the third base member electrically coupling an alternating plurality of second parallel conductive members together; and a fourth base member coupled to the second end of the plurality of second parallel conductive members not connected to the third base member, the fourth base member electrically coupling an alternating plurality of second parallel conductive members together. - View Dependent Claims (12, 13, 14, 15)
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16. A method of manufacturing a capacitor, the method comprising:
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providing a workpiece; forming a first plate and a second plate over the workpiece; and forming a capacitor dielectric between the first plate and the second plate, wherein forming the first plate and the second plate each comprise;
forming a plurality of first parallel conductive members;
forming a plurality of second parallel conductive members over the plurality of first parallel conductive members;
coupling a first base member to an end of at least some of the plurality of first parallel conductive members;
coupling a second base member to an end of at least some of the plurality of second parallel conductive members; and
forming a connecting member between the plurality of first parallel conductive members and the plurality of second parallel conductive members, wherein forming the connecting member comprises forming at least one elongated via, and wherein forming the first plate and the second plate comprises interweaving the plurality of first parallel conductive members of the first plate with the plurality of first parallel conductive members of the second plate, and interweaving the plurality of second parallel conductive members of the first plate with the plurality of second parallel conductive members of the second plate. - View Dependent Claims (17, 18, 19, 20, 21)
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22. A method of manufacturing a semiconductor device, the method comprising:
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providing a workpiece; forming a first conductive material layer over the workpiece, the first conductive material layer including a first insulating material and a plurality of first parallel conductive members disposed within the first insulating material; forming a via layer over the first conductive material layer, the via layer including a second insulating material and a connecting member coupled to the first parallel conductive members, the connecting members being disposed within the second insulating material and comprising at least one elongated via; and forming a second conductive material layer over the via layer, the second conductive material layer including a third insulating material and a plurality of second parallel conductive members disposed within the third insulating material, the plurality of second parallel conductive members being coupled to a connecting member, wherein the plurality of first parallel conductive members, the plurality of second parallel conductive members, and the connecting members comprise at least one capacitor plate. - View Dependent Claims (23, 24, 25)
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Specification