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HEAT DISSIPATION APPARATUS

  • US 20090141451A1
  • Filed: 11/19/2008
  • Published: 06/04/2009
  • Est. Priority Date: 11/21/2007
  • Status: Abandoned Application
First Claim
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1. A heat dissipation apparatus comprising:

  • an insulation substrate including a first surface serving as a heated body receiving surface and a second surface opposite to the first surface, with a metal circuit layer formed on the first surface, and a metal layer formed on the second surface;

    a heat sink thermally coupled to the second surface of the insulation substrate, with the heat sink including an upper case and a lower case and serving as a liquid cooling device including a cooling passage; and

    a stress reduction member formed from a high thermal conductance material and arranged between the metal layer of the insulation substrate and the upper case, with the stress reduction member including a stress absorption hollow and being metal-bonded to the insulation substrate and the heat sink;

    wherein the upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case, with the first portion and the second portion each having a thickness in which the thickness of the first portion is less than the thickness of the second portion.

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