HEAT DISSIPATION APPARATUS

• US 20090141451A1
• Filed: 11/19/2008
• Published: 06/04/2009
• Est. Priority Date: 11/21/2007
• Status: Abandoned Application

• Current Assignee: Showa Denko KK (Resonac Holdings Corp.), Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Original Assignee: Showa Denko KK (Resonac Holdings Corp.), Kabushiki Kaisha Toyota Jidoshokki (Toyota Motor Corporation)
• Inventors: TAMURA, Shinobu, YAMAUCHI, Shinobu, MORI, Shogo
• Application Number:
  US12/273,819
• Publication Number:
  US 20090141451A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of the insulation substrate. The heat sink, which includes an upper case and a lower case, serves as a liquid cooling device including a cooling passage. The stress reduction member is arranged between the insulation substrate and the upper case. The stress reduction member includes stress absorption hollows. The upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case. The first portion has a thickness that is less than that of the second portion.

Claims

1. A heat dissipation apparatus comprising:

an insulation substrate including a first surface serving as a heated body receiving surface and a second surface opposite to the first surface, with a metal circuit layer formed on the first surface, and a metal layer formed on the second surface;

a heat sink thermally coupled to the second surface of the insulation substrate, with the heat sink including an upper case and a lower case and serving as a liquid cooling device including a cooling passage; and

a stress reduction member formed from a high thermal conductance material and arranged between the metal layer of the insulation substrate and the upper case, with the stress reduction member including a stress absorption hollow and being metal-bonded to the insulation substrate and the heat sink;

wherein the upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case, with the first portion and the second portion each having a thickness in which the thickness of the first portion is less than the thickness of the second portion.

2. The heat dissipation apparatus according to claim 1, wherein:

the metal layer and the upper case are formed from aluminum; and

the stress reduction member is formed from an aluminum plate including a plurality of bores.

3. The heat dissipation apparatus according to claim 1, wherein:

the metal layer and the upper case are formed from aluminum; and

the stress reduction member is formed from an aluminum plate including a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink.

4. The heat dissipation apparatus according to claim 1, wherein the upper case has a surface facing toward the stress reduction member that is recessed at a portion corresponding to the first portion from the portion corresponding to the second portion.