WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

• US 20090141464A1
• Filed: 10/31/2008
• Published: 06/04/2009
• Est. Priority Date: 11/29/2007
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: TAGUCHI, Yuichi, Oi, Kiyoshi, Chino, Teruaki
• Granted Patent: US 8,334,461 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/09136 Means for correcting warpage
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.

Claims

1. A wiring board adapted for mounting an electronic component, comprising:

a structure including a plurality of wiring layers stacked one on top of another with an insulating layer interposed therebetween, and interconnected through a via hole formed in the insulating layer,

wherein a plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof.

2. The wiring board according to claim 1, wherein the plurality of openings are formed in such an arrangement as to cut off propagation of a stress being through the wiring board, the stress being induced according to a difference in the coefficient of thermal expansion between a thermosetting material and the wiring board at the interface therebetween when the electronic component is mounted on the wiring board using the thermosetting material.

3. The wiring board according to claim 2, wherein the structure includes a wiring forming region defined by a portion corresponding to a region where the electronic component is mounted, and a peripheral region around the wiring forming region, and the plurality of openings are formed in the peripheral region.

4. The wiring board according to claim 1, further comprising solder resist layers formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.

5. The wiring board according to claim 1, wherein the structure does not include a support base member.

6. An electronic component device comprising:

the wiring board according to claim 1; and

an electronic component mounted on the wiring board with a thermosetting material interposed in therebetween,

wherein the plurality of openings are filled with part of the thermosetting material.