OPTOELECTRONIC SEMICONDUCTOR COMOPNENT CAPABLE OF CENTRALIZING EMITTED LIGHT

• US 20090141516A1
• Filed: 05/08/2008
• Published: 06/04/2009
• Est. Priority Date: 12/03/2007
• Status: Active Grant

• Current Assignee: Lite-On Technology Corporation
• Original Assignee: Lite-On Technology Corporation
• Inventors: Zhang, He-Feng, Wu, Yung-Fu
• Granted Patent: US 7,855,392 B2
• Time in Patent Office: Days
• US Class Current: 362/609
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An optoelectronic semiconductor component includes a light-emitting chip for emitting light, and a reflective substrate. A plurality of linear indent structures is formed on the reflective substrate. The light-emitting chip is installed on the reflective substrate and located on a side of the plurality of linear indent structures. The plurality of linear indent structures is capable of reflecting the light emitted from the light-emitting chip.

Claims

1. An optoelectronic semiconductor component, comprising:

a light emitting chip for emitting light; and

a reflective substrate having a plurality of linear indented structures thereon, wherein the light emitting chip is installed on the reflective substrate and positioned on one side of the linear indented structures, and the linear indented structures are capable of reflecting light emitted from the light emitting chip.

2. The optoelectronic semiconductor component of claim 1, wherein each of the linear indented structures forms a Fresnel Lens.

3. The optoelectronic semiconductor component of claim 1, wherein the linear indented structures surround the light emitting chip.

4. The optoelectronic semiconductor component of claim 3, wherein the linear indented structures surround the light emitting chip according to a circular manner.

5. The optoelectronic semiconductor component of claim 3, wherein the linear indented structures surround the light emitting chip according to an elliptical manner.

6. The optoelectronic semiconductor component of claim 1, wherein the linear indented structures arranged according to a unidirectional manner.

7. The optoelectronic semiconductor component of claim 1, wherein the reflective substrate comprises metal.

8. The optoelectronic semiconductor component of claim 1, wherein the reflective substrate comprises plastic and a high reflective material evaporated thereon.

9. The optoelectronic semiconductor component of claim 1, wherein the reflective substrate comprises a metal electroplated thereon.

10. The optoelectronic semiconductor component of claim 1, wherein the linear indented structures are formed by injection molding.

11. The optoelectronic semiconductor component of claim 1, wherein the linear indented structures are formed by stamping.

12. The optoelectronic semiconductor component of claim 1, wherein the light emitting chip comprises a light emitting diode chip.

13. The optoelectronic semiconductor component of claim 12, wherein the light emitting diode chip comprises a plastic leaded chip carrier light emitting diode chip.

14. The optoelectronic semiconductor component of claim 12, wherein the light emitting diode chip comprises a surface mount device light emitting diode chip.

15. The optoelectronic semiconductor component of claim 1, further comprising an encapsulant covering the light emitting chip and the linear indented structures.

16. The optoelectronic semiconductor component of claim 15, wherein the encapsulant comprises epoxy or silicone.

17. The optoelectronic semiconductor component of claim 1, further comprising a reflective base, wherein the reflective substrate is installed on one side of the reflective base.

18. A side-emitting backlight module, comprising:

an optoelectronic semiconductor component, comprising;

a light emitting chip for emitting light; and

a reflective substrate having a plurality of linear indented structures thereon, wherein the light emitting chip is installed on the reflective substrate and positioned on one side of the linear indented structures, and the linear indented structures are capable of reflecting light emitted from the light emitting chip; and

a light guiding plate installed on one side of the optoelectronic semiconductor component for guiding light reflected by the linear indented structures.

19. The side-emitting backlight module of claim 18, wherein each of the linear indented structures forms a Fresnel Lens.

20. The side-emitting backlight module of claim 18, wherein the linear indented structures surround the light emitting chip.

21. The side-emitting backlight module of claim 20, wherein the linear indented structures surround the light emitting chip according to a circular manner.

22. The side-emitting backlight module of claim 20, wherein the linear indented structures surround the light emitting chip according to an elliptical manner.

23. The side-emitting backlight module of claim 18, wherein the linear indented structures arranged according to a unidirectional manner.

24. The side-emitting backlight module of claim 18, wherein the linear indented structures are substantially parallel to one side of the light guiding plate.

25. The side-emitting backlight module of claim 18, wherein the reflective substrate comprises metal.

26. The side-emitting backlight module of claim 18, wherein the reflective substrate comprises plastic and a high reflective material evaporated thereon.

27. The side-emitting backlight module of claim 18, wherein the reflective substrate comprises a metal electroplated thereon.

28. The side-emitting backlight module of claim 18, wherein the linear indented structures are formed by injection molding.

29. The side-emitting backlight module of claim 18, wherein the linear indented structures are formed by stamping.

30. The side-emitting backlight module of claim 18, wherein the light emitting chip comprises a light emitting diode chip.

31. The side-emitting backlight module of claim 30, wherein the light emitting diode chip comprises a plastic leaded chip carrier light emitting diode chip.

32. The side-emitting backlight module of claim 30, wherein the light emitting diode chip comprises a surface mount device light emitting diode chip.

33. The side-emitting backlight module of claim 18, further comprising an encapsulant covering the light emitting chip and the linear indented structures.

34. The side-emitting backlight module of claim 33, wherein the encapsulant comprises epoxy or silicone.

35. The side-emitting backlight module of claim 18, further comprising a reflective base, wherein the reflective substrate is installed on one side of the reflective base.