TEMPERATURE-SENSING AND TRANSMITTING ASSEMBLIES, PROGRAMMABLE TEMPERATURE SENSOR UNITS, AND METHODS OF MAKING AND USING THEM

• US 20090141771A1
• Filed: 06/02/2007
• Published: 06/04/2009
• Est. Priority Date: 06/03/2006
• Status: Active Grant

• Current Assignee: Precision Linear Systems, Inc.
• Original Assignee: Precision Linear Systems, Inc.
• Inventors: Clifford, Laurence, Owen, William H.
• Granted Patent: US 8,303,179 B2
• Time in Patent Office: Days
• US Class Current: 374/178
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 2201/00 Application of thermometers in air-conditioning systems
• CPC Class Codes: G01K 7/01 using semiconducting elements having PN junctions G01K7/02, G01K7/16, G01K7/30 take precedence
• CPC Class Codes: G01K 7/16 using resistive elements resistive elements per se H01C, H01L

Abstract

In an exemplary embodiment, a temperature sensor and a 4-20 mA transmitter on a single flexible circuit subassembly with a separate housing suitable for use in industrial control or HVAC applications. In a preferred embodiment, a narrow flex circuit substrate includes a silicon diode-based surface-mount sensor at a sensor end, a surface-mount programmable transmitter IC on a flex circuit substrate in the transmitter section, conductive traces connecting the sensor to the transmitter IC, and two conductive pads at an output end for connecting the 4-20 mA output to a pair of external wires. Additional traces on the flex subassembly are provided for testing and programming the transmitter IC and sensor. The sensor end of the flex subassembly is mounted in a metal sensor tube, filled and sealed in the same manner as RTD or thermistor sensors with leads are currently assembled for use in industrial control or HVAC applications.

Claims

1. A temperature-sensing and transmitting assembly comprising:

a flexible circuit substrate comprising a polymer sheet having a first area and a second area, a first plurality of interconnect pads disposed in the first area for electrically coupling to at least a temperature sensor, a second plurality of interconnect pads in the second area for electrically coupling to a programmable transmitter, and a first electrical trace extending from at least one of the first plurality of interconnect pads to at least one of the second plurality of interconnect pads;

a temperature sensor mounted to at least one of the first plurality of interconnect pads and electrically coupled to at least the first electrical trace, the temperature sensor being adapted to sense a temperature and generate an output signal representative of the sensed temperature;

a programmable transmitter mounted to at least a plurality of the second plurality of interconnect pads and electrically coupled to at least the first electrical trace, the programmable transmitter having an input to receive a signal representative of the sensed temperature, and an output to provide an output signal representative of the sensed temperature.

2. The temperature-sensing and transmitting assembly of claim 1 wherein the output signal generated by the temperature sensor has a value that deviates from a first linear relationship between its value and the sensed temperature by a first percentage for a first span of temperature, the first span of temperature having two end points, the first linear relationship comprising a straight line drawn between the values of the temperature sensor'"'"'s output at the two end points of the first span;

wherein the output signal generated by the programmable transmitter has a value that deviates from a second linear relationship between its value and the sensed temperature by a second percentage for the first span of temperature, the second linear relationship comprising a straight line drawn between the values of the programmable transmitters output at the two end points of the first span; and

wherein the second percentage is less than the first percentage.

3. The temperature-sensing and transmitting assembly of claim 1 wherein the temperature sensor comprises a semiconductor-junction diode.

4. The temperature-sensing and transmitting assembly of claim 1 wherein the temperature sensor comprises a plurality of semiconductor-junction diodes.

5. The temperature-sensing and transmitting assembly of claim 4 wherein at least two of the plurality of semiconductor junction diodes are electrically coupled in series.

6. The temperature-sensing and transmitting assembly of claim 1 wherein the output signal of the programmable transmitter is a current signal whose values are within the range of approximately 4 mA to approximately 20 mA.

7. The temperature-sensing and transmitting assembly of claim 1 wherein the programmable transmitter comprises a mapping circuitry that generates the programmable transmitter'"'"'s output signal from the output signal of the temperature sensor, wherein the mapping circuitry has at least one aspect that can be programmed after the programmable transmitter is mounted to the flexible circuit substrate.

8. The temperature-sensing and transmitting assembly of claim 1 wherein the flexible circuit substrate further comprises a portion that spans between the first and second areas of the flexible circuit substrate, the portion having a length from the first area to the second area and a width transverse to its length, the width being less than the length.

9. The temperature-sensing and transmitting assembly of claim 1 further comprising bias circuitry that biases the temperature sensor with a current that is less than 100 μ

A.

10. The temperature-sensing and transmitting assembly of claim 1 wherein the output signal of the programmable transmitter is a current signal, and wherein the assembly further comprises a current sensing resistor coupled to the programmable transmitter'"'"'s output to sense the loop current, the current sensing resistor being a non-precision component.

11. The temperature-sensing and transmitting assembly of claim 1 further comprising:

two connection terminals for connecting the assembly to an external current-sense loop, and a bridge rectifier disposed between the output of the programmable transmitter and the connection terminals.

12. The temperature-sensing and transmitting assembly of claim 11 where the connection terminals comprise spring-force connectors.

13. The temperature-sensing and transmitting assembly of claim 1 further comprising two connection terminals for connecting the assembly to an external current-sense loop, each connection terminal comprising a spring-force connector.

14. The temperature-sensing and transmitting assembly of claim 1 wherein the programmable transmitter comprises a processor chip having circuitry to correct the signal provided by the temperature sensor, a nonvolatile memory to store correction parameters used by the processor chip, and at least two bus terminals adapted to couple to an external programming bus and adapted to receive therefrom signals that cause one or more correction parameters to be stored in said nonvolatile memory, wherein the assembly farther comprises:

at least two connectors to receive an external data programming bus, the at least two connectors being coupled to respective bus terminals of the processor chip, and

a second nonvolatile memory, separate from the processor chip, having at least two bus terminals adapted to couple to an external programming bus to receive signals and adapted to receive therefrom signals that cause the storage of data in the second nonvolatile memory, wherein the bus terminals of the second nonvolatile memory are coupled to the at least two electrical connectors.

15. The temperature-sensing and transmitting assembly of claim 1 wherein the programmable transmitter comprises a processor chip having circuitry to correct the signal provided by the temperature sensor, a nonvolatile memory to store correction parameters used by the processor chip, and at least two bus terminals adapted to couple to an external programming bus and adapted to receive therefrom signals that cause one or more correction parameters to be stored in said nonvolatile memory, wherein the assembly further comprises:

a programming jack having at least one connector to receive an external data programming bus, the at least one connector being coupled to a respective bus terminal of the processor chip.

16. A temperature sensor unit comprising:

a housing having at least one aperture; and

a temperature-sensing and transmitting assembly according to claim 1; and

wherein a first portion of the temperature-sensing and transmitting assembly is disposed in the housing and a second portion of the temperature-sensing and transmitting assembly is disposed through the at least one aperture; and

wherein the temperature sensor of the assembly is disposed outside of the housing.

17. The temperature sensor unit of claim 16 wherein the housing comprises a DIN Form B compliant housing.

18. The temperature sensor unit of claim 17 wherein a hinged door is disposed next to the at least one aperture, the hinged door having a closed position that causes the least one aperture to have a first area, and an open position that causes the aperture to have a second area that is larger than the first area.

19. The temperature sensor unit of claim 16 wherein the housing includes a base and a top adapted to be separable from the base, the top having a front surface facing away from the base when the top is attached to the base, and a back surface facing toward the base when the top is attached to the base;

wherein the base comprises one or more support structures adapted to hold a portion of the temperature-sensing and transmitting assembly within a first area of the base;

wherein the top further comprises a second aperture adapted to expose at least a portion of the first area for viewing when the top is attached to the base.

52. The temperature-sensing and transmitting assembly of claim 14 wherein the first and second nonvolatile memories are integrated together as one nonvolatile memory.

14A. A. (canceled)

20. A housing suitable for DIN Form B housing applications, the housing comprising:

a base having a back surface, a round side surface attached to the back surface, and an open top surface, the round side surface having a diameter that conforms to DIN Form B specifications;

a top adapted to be attached to the base to cover the base'"'"'s open top surface;

a first aperture formed in the back surface of the base, the aperture having a center location that conforms to DIN Form B specifications; and

a hinged door formed in the back surface of the base and adjacent to the first aperture, the hinged door having a closed position adapted to cause the first aperture to have a diameter and first area that conform to DIN Form B specifications, and an open position adapted to cause the first aperture to have a second area that is larger than the first area.

21. The housing of claim 20, wherein the top has a front surface that faces away from the base when the top is attached to the base, and a back surface that faces toward the base when the top is attached to the base;

wherein the base comprises one or more support structures attached to the base'"'"'s back surface and adapted to hold at least a portion of an electrical component within a first area of the base; and

wherein the top further comprises a window disposed at the front surface of the top and positioned to allow at least a portion of said first area to be viewed when the top is attached to the base.

22. The housing of claim 21, wherein the electrical component comprises a temperature-sensing and transmitting assembly.

23. The housing of claim 20, further comprising:

one or more support structures attached to the base'"'"'s back surface and adapted to hold at least a portion of an electrical component within a first area of the base;

a second aperture disposed at the front surface of the top and positioned to allow access to a first portion of the first area, the second aperture being offset from the center point of the top'"'"'s front surface; and

a third aperture disposed at the front surface of the top and positioned to allow access to a second portion of the first area, the third aperture being offset from the center point of the top'"'"'s front surface.

24. The housing of claim 23 further comprising a hinged lid attached to the top, the hinged lid having a closed position that covers the second aperture and an open position that exposes the second aperture.

25. The housing of claim 23, wherein the electrical component comprises a temperature-sensing and transmitting assembly.

26. The housing of claim 20 further comprising a second aperture disposed at the front surface of the top and positioned substantially about the center point of the top'"'"'s front surface, the second aperture having a dimension that is larger than the DIN Form B specification for the diameter of the first aperture.

27. A temperature-sensor housing comprising:

a base having a back surface, a plurality of side surfaces attached to the back surface, and an open top surface;

a top adapted to be attached to the base to cover the base'"'"'s open top surface;

the top having a front surface that faces away from the base when the top is attached to the base, and a back surface that faces toward the base when the top is attached to the base;

one or more support structures attached to the base'"'"'s back surface and adapted to hold at least a portion of an electrical component within a first area of the base;

a window disposed at the front surface of the top and positioned to allow at least a portion of said first area to be viewed when the top is attached to the base.

28. The temperature-sensor housing of claim 27, wherein the electrical component comprises a temperature-sensing and transmitting assembly.

29. A temperature-sensor housing comprising:

a base having a back surface, a plurality of side surfaces attached to the back surface, and an open top surface;

a top adapted to be attached to the base to cover the base'"'"'s open top surface, the top having a front surface that faces away from the base when the top is attached to the base, and a back surface that faces toward the base when the top is attached to the base;

one or more support structures attached to the base'"'"'s back surface and adapted to hold at least a portion of an electrical component within a first area of the base;

a first aperture disposed at the front surface of the top and positioned to allow access to a first portion of the first area; and

a second aperture disposed at the front surface of the top and positioned to allow access to a second portion of the first area.

30. The temperature-sensor housing of claim 29, wherein the electrical component comprises a temperature-sensing and transmitting assembly.

31. The housing of claim 29 further comprising a hinged lid attached to the top, the hinged lid having a closed position that covers the first aperture and an open position that exposes the first aperture.

32-51. -51. (canceled)