Process of Making Electrolessly Plated Auto-Calibration Circuits for Test Sensors

• US 20090142483A1
• Filed: 12/21/2006
• Published: 06/04/2009
• Est. Priority Date: 12/27/2005
• Status: Abandoned Application

• Current Assignee: Bayer Healthcare LLC (Bayer AG)
• Original Assignee: Bayer Healthcare LLC (Bayer AG)
• Inventors: Edelbrock, Andrew J.
• Application Number:
  US12/086,281
• Publication Number:
  US 20090142483A1
• Time in Patent Office: Days
• US Class Current: 427/125
• CPC Class Codes: G01N 33/48771 Coding of information, e.g. calibration data, lot number

Abstract

A method of forming an auto-calibration circuit to be used with a sensor package. The sensor package includes at least one test sensor and is adapted to be used with an instrument or meter. A substrate is provided. Catalytic ink or catalytic polymeric solution is applied to at least one side of the substrate to assist in defining electrical connections on the substrate. The substrate is electrolessly plated with the catalytic ink or catalytic polymeric solution to form the electrical connections of the substrate. The electrical connections convey auto-calibration information for the at least one test sensor to the instrument.

Claims

1. A method of forming an auto-calibration circuit to be used with a sensor package, the sensor package including at least one test sensor and is adapted to be used with an instrument or meter, the method comprising the acts of:

providing a substrate;

applying a catalytic ink or catalytic polymeric solution to at least one side of the substrate, the catalytic ink or catalytic polymeric solution being used to assist in defining electrical connections on the substrate; and

electrolessly plating of the substrate where the catalytic ink or catalytic polymeric solution was applied to form the electrical connections of the substrate, the electrical connections conveying auto-calibration information for the at least one test sensor to the instrument.

4. The method of claim 1, wherein the electroless plating uses a conductive metal being copper, nickel, gold, silver, platinum, palladium, rhodium, cobalt, tin, combinations or alloys thereof.

5. The method of claim 4, wherein the thickness of the conductive metallic material is from about 1 to about 100μ

inches.

6. The method of claim 5, wherein the thickness of the conductive metallic material is from 5 to about 50μ

inches.

8. The method of claim 1, wherein the auto-calibration circuit is adapted to be used with exactly one type of instrument.

10. The method of claim 1, wherein the catalytic ink or catalytic polymeric solution is applied onto the substrate by ink-jet printing.

11. The method of claim 1, wherein the applying of the catalytic ink or catalytic polymeric solution is applied onto the substrate by screen printing.

2. (canceled)

3. (canceled)

7. (canceled)

9. (canceled)

12. (canceled)

13. (canceled)

14. A method of forming an auto-calibration circuit to be used with a sensor package, the sensor package including at least one test sensor and is adapted to be used with an instrument or meter, the method comprising the acts of:

providing a substrate;

forming at least one aperture through the substrate;

applying a catalytic ink or catalytic polymeric solution to two opposing sides of the substrate, the catalytic ink or catalytic polymeric solution being used to assist in defining electrical connections on the substrate; and

electrolessly plating of the substrate where the catalytic ink or catalytic polymeric solution was applied to form the electrical connections of the substrate, the electrical connections conveying auto-calibration information for the at least one test sensor to the instrument.

15. The method of claim 14, wherein at least one aperture is formed by a laser prior to defining the electrical connections of the substrate.

16. The method of claim 14, wherein at least one aperture is formed by punching prior to defining the electrical connections of the substrate.

20. The method of claim 14, wherein the electroless plating uses a conductive metal being copper, nickel, gold, silver, platinum, palladium, rhodium, cobalt, tin, combinations or alloys thereof.

21. The method of claim 20, wherein the thickness of the conductive metallic material is from about 1 to about 100μ

inches.

22. The method of claim 21, wherein the thickness of the conductive metallic material is from 5 to about 50μ

inches.

17. (canceled)

18. (canceled)

19. (canceled)

23. (canceled)

24. (canceled)

25. (canceled)

26. A method of forming a sensor package adapted to be used with at least one instrument in determining an analyte concentration in a fluid sample, the method comprising the acts of:

providing a substrate;

applying a catalytic ink or catalytic polymeric solution to at least one side of the substrate, the catalytic ink or catalytic polymeric solution being used to assist in defining the electrical connections on the substrate; and

electrolessly plating of the substrate where the catalytic ink or catalytic polymeric solution was applied to form the electrical connections of the substrate, the electrical connections conveying auto-calibration information for the at least one test sensor to the instrument;

attaching the auto-calibration circuit to a surface of a sensor-package base; and

providing at least one test sensor being adapted to receive the fluid sample and being operable with at least one instrument.

27. The method of claim 26, wherein the at least one test sensor is a plurality of sensors and further providing a pluralities of cavities containing a respective one of the pluralities of test sensors, the plurality of test cavities being arranged around the auto-calibration circuit.

28. The method of claim 26, wherein the substrate is a polymeric material.

30. The method of claim 26, wherein the electroless plating uses a conductive metal being copper, nickel, gold, silver, platinum, palladium, rhodium, cobalt, tin, combinations or alloys thereof.

31. The method of claim 30, wherein the thickness of the conductive metallic material is from about 1 to about 100μ

inches.

32. The method of claim 31, wherein the thickness of the conductive metallic material is from 5 to about 50μ

inches.

37. The method of claim 26 further including drying or curing the electroless plating catalyst solution or ink.

29. (canceled)

33. (canceled)

34. (canceled)

35. (canceled)

36. (canceled)