Led chip package structure with high-efficiency light-emitting effect and method for making the same

• US 20090146156A1
• Filed: 09/29/2008
• Published: 06/11/2009
• Est. Priority Date: 12/10/2007
• Status: Active Grant

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Wu, Wen-Kuei, Wu, Shih-Yu
• Granted Patent: US 7,829,901 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer

Abstract

An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

Claims

1. A method for making an LED chip package structure with high-efficiency light-emitting effect, comprising:

providing a substrate unit;

electrically arranging a plurality of LED chips on the substrate unit via a matrix method to form a plurality of transverse LED chip rows;

longitudinally covering the transverse LED chip rows with a package colloid using a first mold unit, wherein the package colloid has a plurality of cambered colloid surfaces that are formed on its top side and correspond to the transverse LED chip rows;

transversely cutting the package colloid along a line between each two adjacent and longitudinal LED chips to form a plurality of longitudinal package colloids that are separated from each other and respectively covering the transverse LED chip rows, wherein the top surface of each longitudinal package colloid is the cambered colloid surface and each longitudinal package colloid has a light-emitting colloid surface formed in front of its cambered colloid surface;

respectively covering and filling a frame unit on the substrate unit, on the longitudinal package colloids, and between each two adjacent longitudinal package colloids using a second mold unit; and

transversely cutting the frame unit and the substrate unit along the line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a frame layer for exposing the light-emitting colloid surfaces of the longitudinal package colloids.

2. The method as claimed in claim 1, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

3. The method as claimed in claim 1, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body.

4. The method as claimed in claim 3, wherein the substrate body has a metal layer and a Bakelite layer formed on the metal layer.

5. The method as claimed in claim 3, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

6. The method as claimed in claim 3, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit.

7. The method as claimed in claim 6, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

8. The method as claimed in claim 6, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

9. The method as claimed in claim 1, wherein the LED chips are arranged on the substrate unit along a straight line.

10. The method as claimed in claim 1, wherein the first mold unit is composed of a first upper mold and a first lower mold for supporting the substrate unit, and the first upper mold has a first channel that has a plurality of grooves, wherein each groove has a cambered mold surface and a lateral mold surface respectively formed on its top surface and a lateral surface thereof, and the cambered mold surface is used to form the corresponding cambered colloid surface and the lateral mold surface is used to form the corresponding lateral colloid surface.

11. The method as claimed in claim 1, wherein the package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

12. The method as claimed in claim 1, wherein the package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

13. The method as claimed in claim 1, wherein the second mold unit is composed of a second upper mold and a second lower mold for supporting the substrate body, the second upper mold has a second channel corresponding to the frame unit, and the size of the second channel is the same as the size of the frame unit.

14. The method as claimed in claim 1, wherein the frame layer is an opaque frame layer.

15. The method as claimed in claim 14, wherein the opaque frame layer is a white frame layer.

16. A method for making an LED chip package structure with high-efficiency light-emitting effect, comprising:

providing a substrate unit;

electrically arranging a plurality of LED chips on the substrate unit via a matrix method to form a plurality of transverse LED chip rows;

transversely covering a plurality of longitudinal package colloids on the transverse LED chip rows using a first mold unit, wherein each longitudinal package colloid has a cambered colloid surface formed on its top side, and each longitudinal package colloid has a light-emitting colloid surface formed on a lateral surface thereof and in front of its cambered colloid surface;

respectively covering and filling a frame unit on the substrate unit, on the longitudinal package colloids, and between each two adjacent longitudinal package colloids using a second mold unit; and

transversely cutting the frame unit and the substrate unit along the line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each light bar has a frame layer for exposing the light-emitting colloid surfaces of the longitudinal package colloids.

17. The method as claimed in claim 16, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

18. The method as claimed in claim 16, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body.

19. The method as claimed in claim 18, wherein the substrate body has a metal layer and a Bakelite layer formed on the metal layer.

20. The method as claimed in claim 18, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

21. The method as claimed in claim 18, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit.

22. The method as claimed in claim 21, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

23. The method as claimed in claim 21, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

24. The method as claimed in claim 16, wherein the LED chips are straightly arranged on the substrate unit along a straight line.

25. The method as claimed in claim 16, wherein the first mold unit is composed of a first upper mold and a first lower mold for supporting the substrate unit, and the first upper mold has a plurality of first channels, wherein each first channel has a cambered mold surface and a lateral mold surface respectively formed on its top surface and a lateral surface thereof, the cambered mold surface is used to form the corresponding cambered colloid surface and the lateral mold surface is used to form the corresponding lateral colloid surface, and the size of each first channel is the same as the size of each longitudinal package colloid.

26. The method as claimed in claim 16, wherein each longitudinal package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

27. The method as claimed in claim 16, wherein each longitudinal package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

28. The method as claimed in claim 16, wherein the second mold unit is composed of a second upper mold and a second lower mold for supporting the substrate body, the second upper mold has a second channel corresponding to the frame unit, and the size of the second channel is the same as the size of the frame unit.

29. The method as claimed in claim 16, wherein the frame layer is an opaque frame layer.

30. The method as claimed in claim 29, wherein the opaque frame layer is a white frame layer.

31. An LED chip package structure with high-efficiency light-emitting effect, comprising:

a substrate unit;

a light-emitting unit having a plurality of LED chips electrically arranged on the substrate unit;

a package colloid unit having a longitudinal package colloid covering the LED chips, wherein the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof; and

a frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

32. The LED chip package structure as claimed in claim 31, wherein the substrate unit is a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

33. The LED chip package structure as claimed in claim 31, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body.

34. The LED chip package structure as claimed in claim 33, wherein the substrate body has a metal layer and a Bakelite layer formed on the metal layer.

35. The LED chip package structure as claimed in claim 33, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

36. The LED chip package structure as claimed in claim 33, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit.

37. The LED chip package structure as claimed in claim 36, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

38. The LED chip package structure as claimed in claim 36, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

39. The LED chip package structure as claimed in claim 31, wherein the LED chips are straightly arranged on the substrate unit along a straight line.

40. The LED chip package structure as claimed in claim 31, wherein the LED chips are straightly arranged on the substrate unit along a plurality of straight lines.

41. The LED chip package structure as claimed in claim 31, wherein the longitudinal package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

42. The LED chip package structure as claimed in claim 31, wherein the longitudinal package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

43. The LED chip package structure as claimed in claim 31, wherein the frame layer is an opaque frame layer.

44. The LED chip package structure as claimed in claim 43, wherein the opaque frame layer is a white frame layer.