Package for Light Emitting Device and Method for Packaging the Same

• US 20090146158A1
• Filed: 12/31/2004
• Published: 06/11/2009
• Est. Priority Date: 12/17/2004
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Park, Jun Seok
• Granted Patent: US 8,035,121 B2
• Time in Patent Office: Days
• US Class Current: 257/89
• CPC Class Codes: F21K 9/69 Details of refractors forming part of the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 5/045 the lens having discontinuous faces, e.g. Fresnel lenses
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 5/1876 Diffractive Fresnel lenses; Zone plates; Kinoforms G02B5/1842, G02B5/1847 take precedence; optical systems having diffractive correction means G02B27/0037; Fresnel lenses operating by refraction G02B3/08
• CPC Class Codes: G02B 5/1885 Arranged as a periodic array
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer

Abstract

There are provided a light emitting device package and a method for manufacturing the same. The light emitting device includes: a plurality of barriers provided above a metal circuit board; a plurality of light emitting devices placed in a space between the barriers; and a lens unit provided at an upper side of the barrier. Accordingly, the plurality of light emitting devices can be conveniently seated as a module format, and a luminance can be increased. Also, an efficiency of heat sink can be increased.

Claims

1. A light emitting device package comprising:

a circuit board;

at least one barrier part provided to have a predetermined thickness above the circuit board;

at least one light emitting device chip seated at an internal space of the at least one barrier part, and having a power source applied from the circuit board;

a molding part filling the internal space of the at least one barrier part where the light emitting device chip is housed; and

a lens unit having at least one lens provided at an upper side of the molding part.

2. The package according to claim 1, wherein a selected light emitting device chip of the at least one light emitting device chip has at least one light emitting device.

3. The package according to claim 1, wherein the lens unit has a structure that a plurality of lenses are integrated.

4. The package according to claim 1, wherein the circuit board is a metal circuit board.

5. The package according to claim 1, wherein the at least one light emitting device chip is selected from a SiOB (Silicon Optical Bench) chip, a red light-emitting-device chip, a blue light-emitting-device chip, and a green light-emitting-device chip.

6. The package according to claim 1, wherein the at least one barrier part comprises a plurality of integrated barriers provided at the circuit board in various patterns.

7. The package according to claim 1, wherein the molding part or the at least one light emitting device chip has at least one kind of phosphor.

8. A light emitting device package comprising:

a light emitting device module comprising;

a light emitting device chip comprised of at least one light emitting device,

a first barrier for housing the light emitting device chip, and

a molding part provided in an internal space of the first barrier;

a circuit board comprising;

an electric circuit layer having a circuit electrically connecting with the light emitting device module,

an insulating layer provided at a lower surface of the electric circuit layer, and

a metal core PCB (Print Circuit Board) base for dissipating a heat to the exterior; and

a lens unit provided at an upper side of the light emitting device module.

9. The package according to claim 8, wherein the lens unit is fixed to a second barrier positioned outside of the first barrier.

10. The package according to claim 8, wherein the lens unit is comprised of any one of a concave-shaped lens, a convex-shaped lens, a trapezoid-shaped lens, an inverted pyramid-shaped lens and a fresnel lens.

11. The package according to claim 8, wherein the light emitting device module is series-connected or parallel-connected in plurality to the circuit board.

12. The package according to claim 8, wherein the light emitting device module is disposed in plurality at the circuit board to be in a row or in plural rows.

13. The package according to claim 8, wherein the light emitting device chip comprises red, green and blue light emitting devices disposed in parallel.

14. The package according to claim 8, wherein the electric circuit layer has an electrode electrically connecting with the light emitting device chip.

15. The package according to claim 8, wherein the light emitting device module is used as a light source of a signal displaying device or a display device.

16. The package according to claim 8, wherein the circuit board has a heat sink plate at its lower portion.

17. The package according to claim 8, wherein the metal core PCB base has a thermal conductive material coated on its lower portion.

18. The package according to claim 8, wherein the light emitting device module is comprised of at least one of a red light-emitting-device chip, a green light-emitting-device chip, a blue light-emitting-device chip, a yellow light-emitting-device chip and an orange light-emitting-device chip.

19. The package according to claim 8, wherein the light emitting device chip is a SiOB (Silicon Optical Bench) chip.

20. The package according to claim 8, wherein the circuit layer electrode is plated with gold or aluminum.

21. The package according to claim 8, wherein the light emitting device module has at least one kind of phosphor.

22. The package according to claim 8, wherein the barrier has a thickness of 50 to 100 μ

m.

23. The package according to claim 8, further comprising a reflection material or a gloss agent at externally exposed surfaces of the electric circuit layer and the insulating layer.

24. A light emitting device package comprising:

a plurality of light emitting devices;

a metal circuit board for seating the plurality of light emitting devices thereat to input and output a power source to and from the plurality of light emitting devices;

a barrier surrounding each light emitting device of the plurality of light emitting devices and above the metal circuit board; and

a lens unit disposed at an upper side of the barrier.

25. The package according to claim 24, wherein the barrier reflects light emitted from the plurality of light emitting devices.

26. The package according to claim 24, further comprises a heat sink plate attached to a rear surface of the circuit board to dissipate a heat to the exterior.

27. The package according to claim 24, wherein the lens unit has a fresnel lens.

28. The package according to claim 24, wherein the barrier is two-folded.

29. The package according to claim 24, wherein the barrier is formed of copper (Cu), aluminum (Al) or polycarbonate.

30. A method of manufacturing a light emitting device package, the method comprising:

mounting a plurality of light emitting devices above a metal circuit board;

providing a barrier above the circuit board;

performing a molding process in an internal space of the barrier where the light emitting device is mounted; and

attaching a lens at an upper side of the barrier after the molding process is performed.

31. The method according to claim 30, further comprising providing a heat sink plate at a rear surface of the circuit board.

32. The method according to claim 30, wherein the barrier is two-folded.