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Package for Light Emitting Device and Method for Packaging the Same

  • US 20090146158A1
  • Filed: 12/31/2004
  • Published: 06/11/2009
  • Est. Priority Date: 12/17/2004
  • Status: Active Grant
First Claim
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1. A light emitting device package comprising:

  • a circuit board;

    at least one barrier part provided to have a predetermined thickness above the circuit board;

    at least one light emitting device chip seated at an internal space of the at least one barrier part, and having a power source applied from the circuit board;

    a molding part filling the internal space of the at least one barrier part where the light emitting device chip is housed; and

    a lens unit having at least one lens provided at an upper side of the molding part.

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  • 2 Assignments
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