FABRICATION OF NONPOLAR INDIUM GALLIUM NITRIDE THIN FILMS, HETEROSTRUCTURES AND DEVICES BY METALORGANIC CHEMICAL VAPOR DEPOSITION
First Claim
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1. A p-n junction device, comprising:
- an n-type layer and a p-type layer;
a nonpolar oriented Indium-containing III-nitride layer between the n-type layer and the p-type layer; and
a material quality of the Indium-containing III-nitride layer enabling a measurement of output power of the p-n junction device as a function of direct current.
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Abstract
A method for the fabrication of nonpolar indium gallium nitride (InGaN) films as well as nonpolar InGaN-containing device structures using metalorganic chemical vapor deposition (MOVCD). The method is used to fabricate nonpolar InGaN/GaN violet and near-ultraviolet light emitting diodes and laser diodes.
48 Citations
14 Claims
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1. A p-n junction device, comprising:
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an n-type layer and a p-type layer; a nonpolar oriented Indium-containing III-nitride layer between the n-type layer and the p-type layer; and a material quality of the Indium-containing III-nitride layer enabling a measurement of output power of the p-n junction device as a function of direct current. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An opto-electronic or electronic device, comprising:
a nonpolar oriented Indium-containing III-nitride layer for use as a nonpolar active layer in the device, wherein a material quality of the nonpolar Indium-containing III-nitride layer and the device enables a measurement of an amount of nonpolarity of the device. - View Dependent Claims (8, 9, 11, 12)
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13. A method of fabricating a nonpolar Indium-containing III-nitride device, comprising:
forming a cap layer between one or more III-nitride device layers and one or more nonpolar oriented Indium-containing III-nitride layers, wherein the cap layer prevents Indium desorbing from the Indium-containing III-nitride layers when the III-nitride device layers are formed.
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14. A substrate for one or more III-nitride device layers, comprising:
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a nonpolar oriented Indium-containing III-nitride layer; and a cap layer on the Indium-containing III-nitride layer, wherein the cap layer prevents Indium desorbing from the Indium-containing III-nitride layer when the III-nitride device layers are formed on the cap layer.
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Specification