INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF MANUFACTURE THEREOF

• US 20090146315A1
• Filed: 02/16/2009
• Published: 06/11/2009
• Est. Priority Date: 08/08/2005
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Lte.
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Chow, Seng Guan, Han, Byung Joon, Shim, Il Kwon
• Granted Patent: US 8,643,163 B2
• Time in Patent Office: Days
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 2225/1094 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2201/1053 : Mounted components directly electrically connected to each other, i.e. not via the PCB
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

An integrated circuit package-on-package stacking system includes: providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package, attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents, and attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.

Claims

1. A method of manufacture of an integrated circuit package-on-package stacking system comprising:

providing a first integrated circuit package;

mounting a metalized interposer substrate over the first integrated circuit package;

attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents; and

attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.

2. The method as claimed in claim 1 further comprising providing a transition interconnect on the first integrated circuit package.

3. The method as claimed in claim 1 further comprising:

providing a contact pad on the metalized interposer substrate; and

coupling a discrete component to the contact pad.

4. The method as claimed in claim 1 wherein attaching the second integrated circuit package includes providing the second integrated circuit package in which the second integrated circuit package being smaller than the first integrated circuit package.

5. The method as claimed in claim 1 further comprising providing an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof.

6. A method of manufacture of an integrated circuit package-on-package stacking system comprising:

providing a first integrated circuit package having a through conductor;

mounting a metalized interposer substrate over the first integrated circuit package, in which the metalized interposer substrate provides a redistribution layer;

attaching a stiffener on the metalized interposer substrate and having dimensions within package extents based on the metalized interposer substrate; and

attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener, in which providing a ball pitch for the second integrated circuit package requires less space than for the first integrated circuit package.

7. The method as claimed in claim 6 further comprising providing a transition interconnect on the first integrated circuit package, in which providing the transition interconnect includes providing a solder ball.

8. The method as claimed in claim 6 further comprising:

providing a contact pad on the metalized interposer substrate, in which providing a contact pad includes a contact pad on the interposer top and on the interposer bottom; and

coupling a discrete component to the contact pad, in which coupling the discrete component may provide an active component or a passive component.

9. The method as claimed in claim 6 wherein attaching the second integrated circuit package includes providing the second integrated circuit package in which the second integrated circuit package being smaller than the first integrated circuit package, with the second integrated circuit package including a land grid array, a ball grid array, or a leadless package.

10. The method as claimed in claim 6 further comprising providing an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof, in which providing the electromagnetic shield includes mounting the electromagnetic shield on the metalized interposer substrate.

11. An integrated circuit package-on-package stacking system comprising:

a first integrated circuit package;

a metalized interposer substrate over the first integrated circuit package;

a stiffener integrated with the metalized interposer substrate and having dimensions within package extents; and

a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.

12. The system as claimed in claim 11 further comprising a transition interconnect on the first integrated circuit package.

13. The system as claimed in claim 11 further comprising:

a contact pad on the metalized interposer substrate; and

a discrete component coupled to the contact pad.

14. The system as claimed in claim 11 wherein the second integrated circuit package on the metalized interposer substrate, includes the second integrated circuit package is smaller than the first integrated circuit package.

15. The system as claimed in claim 11 further comprising an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof.

16. The system as claimed in claim 11 further comprising:

a through conductor in the first integrated circuit package;

the metalized interposer substrate over the first integrated circuit package, in which the metalized interposer substrate provides a redistribution layer;

the stiffener is on the metalized interposer substrate and having dimensions within package extents based on the metalized interposer substrate; and

a ball pitch for the second integrated circuit package requires less space than for the first integrated circuit package.

17. The system as claimed in claim 16 further comprising a transition interconnect on the first integrated circuit package, in which the transition interconnect includes a solder ball.

18. The system as claimed in claim 16 further comprising:

a contact pad on the metalized interposer substrate, includes a contact pad on the interposer top and on the interposer bottom; and

a discrete component coupled to the contact pad, in which the discrete component may provide an active component or a passive component.

19. The system as claimed in claim 16 wherein the second integrated circuit package attached includes the second integrated circuit package is smaller than the first integrated circuit package, with the second integrated circuit package includes a land grid array, a ball grid array, or a leadless package.

20. The system as claimed in claim 16 further comprising an electromagnetic shield over the second integrated circuit package, a discrete component, or a combination thereof, in which the electromagnetic shield is mounted on the metalized interposer substrate.