HEAT DISSIPATION APPARATUS

• US 20090147479A1
• Filed: 11/19/2008
• Published: 06/11/2009
• Est. Priority Date: 11/21/2007
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko KK, Sowa Denko K.K.
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko KK
• Inventors: Yamauchi, Shinobu, Tamura, Shinobu, MORI, Shogo
• Application Number:
  US12/273,703
• Publication Number:
  US 20090147479A1
• Time in Patent Office: Days
• US Class Current: 361/699
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.

Claims

1. A heat dissipation apparatus comprising:

an insulation substrate including a first surface serving as a heated body receiving surface and a second surface opposite to the first surface, with a metal circuit layer formed on the first surface and a metal layer of aluminum formed on the second surface;

a heat sink thermally coupled to the second surface of the insulation substrate, with the heat sink being formed from aluminum and serving as a liquid cooling device including a cooling passage; and

a heat mass member formed from aluminum and arranged between the metal layer of the insulation substrate and the heat sink, with the heat mass member being metal-bonded to the insulation substrate and the heat sink,

wherein the heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other, the stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate of the heat mass member and a surface facing toward the heat sink, the heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.

2. The heat dissipation apparatus according to claim 1, wherein the thickness of the heat mass portion is at least two times greater than the thickness of the stress reduction portion.

3. The heat dissipation apparatus according to claim 1, wherein the heated body receiving surface includes a surface for receiving a semiconductor device.