METHOD OF MANUFACTURING A SYSTEM IN PACKAGE

• US 20090148966A1
• Filed: 07/18/2006
• Published: 06/11/2009
• Est. Priority Date: 07/19/2005
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Cauvet, Philippe L. L., Fleury, Herve, Verjus, Fabrice
• Granted Patent: US 7,960,189 B2
• Time in Patent Office: Days
• US Class Current: 438/15
• CPC Class Codes: G01R 31/2815 Functional tests, e.g. boundary scans, using the normal I/O contacts contacting devices G01R31/2808; testing digital circuits G01R31/317, G06F11/00
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/303 of integrated circuits G01R31/305 - G01R31/315 take precedence
• CPC Class Codes: G01R 31/318513 Test of Multi-Chip-Moduls
• CPC Class Codes: G01R 31/318533 using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system in package (10) has a, preferably wireless, test controller (20) for testing each die (30) after it has bee mounted onto the substrate of the system in package (10), and a faulty die (30) is repaired before a next die (30) is mounted onto the substrate (15). This way, the system in package (10) can be tested during the intermediate stages of its manufacturing, thus ensuring that all dies (30) function correctly before sealing the dies in the single package. Consequently, a method for manufacturing a system in package (10) is obtained that has an improved yield compared to known manufacturing methods.

Claims

1. A method of manufacturing a system in package, comprising:

providing a substrate;

mounting a test controller on the substrate;

mounting a first die on the substrate, the first die being conductively coupled to the test controller;

testing the first die by providing the test controller with a plurality of test signals and communicating at least a subset of the test signals between the test controller and the first die;

mounting a second die on the substrate, the second die being conductively coupled to the test controllers; and

testing the second die by providing the test controller with a first further plurality of test signals and communicating at least a subset of the first further plurality of test signals between the test controller and the second die.

2. A method as claimed in Claim 1, wherein the steps of providing the test controller with the plurality and the first further plurality of test signals are performed wirelessly.

3. A method as claimed in claim 1, further comprising:

repairing the first die in case the first die failed the test; and

providing the test controller with the plurality of test signals for retesting the repaired first die.

4. A method as claimed in claim 1, further comprising providing the test controller with a second further plurality of test signals for testing the first die in conjunction with the second die.

5. A method as claimed in claim 1, wherein communicating the test signals between the test controller and the first die and/or the second die complies with the IEEE 1149.1 standard.

6. A method as claimed in claim 1, wherein communicating the test signals between the test controller and the first die and/or the second die complies with the IEEE 1500 standard.

7. A method as claimed in claim 1, further comprising testing the test controller prior to mounting the first die on the substrate.

8. A method as claimed in claim wherein the first die and the second die are respectively conductively coupled to the test controller via separate conductive paths.