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Method of Manufacturing Compound Semiconductor Devices

  • US 20090148982A1
  • Filed: 01/21/2009
  • Published: 06/11/2009
  • Est. Priority Date: 03/09/2005
  • Status: Abandoned Application
First Claim
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1. A method of manufacturing a compound semiconductor device, comprising:

  • forming a plurality of spherical balls;

    coating the spherical balls onto a substrate;

    growing a buffer layer on the substrate on which the spherical balls are coated;

    selectively growing a compound semiconductor thin film between the spherical balls;

    growing the compound semiconductor thin film in a lateral direction so that it grows on the spherical balls; and

    continuously growing the compound semiconductor thin film to a desired thickness.

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