Method of Manufacturing Flexible Semiconductor Assemblies
First Claim
1. A method of fabricating an integrated circuit package from a wafer comprising a plurality of semiconductor dice, the wafer defining a first side and a second side, the method comprising:
- attaching a flexible dielectric membrane to the first side of the wafer to form a wafer assembly, wherein the flexible dielectric membrane electrically interconnects a group of at least two adjacent semiconductor dice that are intended to form the integrated circuit package;
removing wafer material from the second side of the wafer to form one or more bending regions, wherein the wafer material is removed substantially to the depth of the flexible dielectric membrane, and further wherein the wafer material is removed between the at least two adjacent semiconductor dice within the group;
singulating the integrated circuit package by removing the wafer material and flexible membrane material connecting the group of semiconductor dice to the wafer assembly; and
1 Assignment
0 Petitions
Accused Products
Abstract
A method for producing flexible semiconductor assemblies is described. For example, an integrated circuit package consisting of an X-Y axes sensor die and a Z-axis sensor die disposed at 90 degrees to each other may be formed by applying a flexible dielectric membrane to a semiconductor wafer, creating bending gaps between the sensor dice, singulating the IC package from the wafer, and bending the flexible dielectric membrane so that the sensor dice are disposed orthogonally to each other. This method eliminates the need to precisely position previously singulated sensor dice relative to each other in order to apply a flexible dielectric membrane for purposes of interconnecting the dice.
-
Citations
18 Claims
-
1. A method of fabricating an integrated circuit package from a wafer comprising a plurality of semiconductor dice, the wafer defining a first side and a second side, the method comprising:
-
attaching a flexible dielectric membrane to the first side of the wafer to form a wafer assembly, wherein the flexible dielectric membrane electrically interconnects a group of at least two adjacent semiconductor dice that are intended to form the integrated circuit package; removing wafer material from the second side of the wafer to form one or more bending regions, wherein the wafer material is removed substantially to the depth of the flexible dielectric membrane, and further wherein the wafer material is removed between the at least two adjacent semiconductor dice within the group; singulating the integrated circuit package by removing the wafer material and flexible membrane material connecting the group of semiconductor dice to the wafer assembly; and - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
-
17. A method of fabricating an integrated circuit package from a wafer comprising a plurality of semiconductor dice, the wafer defining a first side and a second side, the method comprising:
-
laminating a flexible dielectric sheet as a first dielectric layer to the first side of the wafer to form a wafer assembly; using photolithography to create a first set of vias, wherein the first set of vias penetrates through the first dielectric layer to a group of at least two adjacent semiconductor dice that are intended to form the integrated circuit package; depositing a first conductive material in the vias; forming conductive interconnection routes between the vias to create a first interconnection interface; depositing a second flexible dielectric layer; using photolithography to create the second set of vias, wherein the second set of vias penetrates through the second dielectric layer to the interconnection interface of the first dielectric layer; depositing a second conductive material in the second set of vias; forming conductive interconnection routes between the second set of vias to create a second interconnection interface; orienting the wafer assembly so that the second wafer side is face up; using a dicing saw to remove wafer material from the second side of the wafer to form one or more bending regions, wherein the wafer material is removed substantially to the depth of the flexible dielectric membrane, and further wherein the material is removed between the at least two adjacent semiconductor dice within the group; using a dicing saw to singulate the integrated circuit package by removing the wafer material and flexible membrane material connecting the group of semiconductor dice to the wafer assembly; and bending the flexible dielectric membrane at the one or more bending regions.
-
-
18. The method of claim 18 wherein the first conductive material and the second conductive material are the same material.
Specification