COMPOSITION FOR PRODUCING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

• US 20090151987A1
• Filed: 12/04/2008
• Published: 06/18/2009
• Est. Priority Date: 12/14/2007
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Fine Chemicals Company Limited (Lotte Chemical Corporation), Samsung Electronics Co. Ltd., Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: SUH, Sang Hyuk, GU, Bon Hyeok, JUNG, Myung Sup, CHO, Chung Kun, YANG, Yoo Seong
• Granted Patent: US 7,943,856 B2
• Time in Patent Office: Days
• US Class Current: 174/250
• CPC Class Codes: C08G 73/101 containing chain terminating or branching agents
• CPC Class Codes: C08L 2205/02 containing two or more polymers of the same C08L -group
• CPC Class Codes: C08L 2666/18 Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
• CPC Class Codes: C08L 2666/20 Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
• CPC Class Codes: C08L 67/00 Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain of polyester-amides C08L77/12; of polyester-imides C08L79/08; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 69/00 Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: C09K 19/38 Polymers
• CPC Class Codes: C09K 19/3809 Polyesters; Polyester derivatives, e.g. polyamides
• CPC Class Codes: C09K 19/3838 Polyesters; Polyester derivatives
• CPC Class Codes: H05K 1/0353 consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0141 Liquid crystal polymer [LCP]
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.

Claims

1. A composition for producing a printed circuit board, comprising a polyamic acid having one or two crosslinkable functional groups located at one or both ends thereof, a liquid crystal polymer or a liquid crystalline thermoset oligomer and an organic solvent wherein the polyamic acid has a structure represented by Formula 1:

2. The composition of claim 1, wherein the polyamic acid has a number average molecular weight of about 1,000 to about 90,000 rams per mole.

3. The composition of claim 1, wherein the polyamic acid and the liquid crystal polymer or the liquid crystalline thermoset oligomer are mixed in a weight ratio of about 1:

9 to about 9;

1.

4. The composition of claim 1, wherein in Formula 1, X is a tetravalent organic group selected from the group consisting of

5. The composition of claim 1, wherein the polyamic acid is represented by Formula 3 or 4:

6. The composition of claim 1, wherein the liquid crystal polymer is selected from the group consisting of liquid crystal polyesters, liquid crystal polyamides, liquid crystal polyester amides, liquid crystal polyester imides, liquid crystal polyamide imides, and mixtures thereof.

7. The composition of claim 1, wherein the liquid crystalline thermoset oligomer is represented by Formula 5:

Z₃-Y₃

Ar—

Y₄

_nY₅-Z₄  

 

(5)

wherein Y₃, Y₄ and Y₅, which are identical to or different from each other, each representing a divalent aliphatic or aromatic organic group containing at least one moiety selected from the group consisting of esters, amides, ethers and imides, Ar is a divalent aromatic organic group containing at least one aromatic structural unit selected from the group consisting of the units of Formulae 6;

8. The composition of claim 1, further comprising an inorganic filler.

9. The composition of claim 8, wherein the inorganic filler is selected from the group consisting of silica, aluminum borate, potassium titanate, magnesium sulfate, silicon carbide, zinc oxide, silicon nitride, silicon dioxide, aluminum titanate, barium titanate, barium strontium titanate, aluminum oxide, and mixtures thereof.

10. The composition of claim 1, wherein the composition comprises about 5 to about 100 parts by weight of the polyamic acid, about 5 to about 100 parts by weight of the liquid crystal polymer or the liquid crystalline thermoset oligomer, and about 100 parts by weight of the organic solvent.

11. A film produced by solvent casting a composition for producing a printed circuit board, the composition comprising a polyamic acid having one or two crosslinkable functional groups located at one or both ends thereof, a liquid crystal polymer or a liquid crystalline thermoset oligomer and an organic solvent wherein the polyamic acid has a structure represented by Formula 1:

12. A prepreg produced by impregnating a reinforcing material with a composition for producing a printed circuit board, the composition comprising a polyamic acid having one or two crosslinkable functional groups located at one or both ends thereof, a liquid crystal polymer or a liquid crystalline thermoset oligomer and an organic solvent wherein the polyamic acid has a structure represented by Formula 1:

13. The prepreg of claim 12, wherein the reinforcing material is selected from the group consisting of glass cloth, woven alumina glass fibers, glass fiber non-woven fabrics, cellulose non-woven fabrics, woven carbon fibers, polymer fabrics, and combinations thereof.

14. A printed circuit board comprising a prepreg produced by impregnating a reinforcing material with a composition for producing a printed circuit board, the composition comprising a polyamic acid having one or two crosslinkable functional groups located at one or both ends thereof, a liquid crystal polymer or a liquid crystalline thermoset oligomer and an organic solvent wherein the polyamic acid has a structure represented by Formula 1: