ULTRASONIC WELDING-BASED MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20090152326A1
• Filed: 06/19/2008
• Published: 06/18/2009
• Est. Priority Date: 12/17/2007
• Status: Abandoned Application

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Jeong, Min Suk, Kim, Hye Yoon, Kim, Young Jun, Park, Seon Hee, Jung, Moon Youn, Kim, Sang Hee, SHIN, Dong Ho
• Application Number:
  US12/142,712
• Publication Number:
  US 20090152326A1
• Time in Patent Office: Days
• US Class Current: 228/110.100
• CPC Class Codes: B29C 65/08 using ultrasonic vibrations non-plastics element to plastics elements B29C65/645
• CPC Class Codes: B29C 65/7829 said distance pieces being integral with at least one of the parts to be joined
• CPC Class Codes: B29C 66/112 Single lapped joints
• CPC Class Codes: B29C 66/114 Single butt joints
• CPC Class Codes: B29C 66/3022 said melt initiators being integral with at least one of the parts to be joined
• CPC Class Codes: B29C 66/542 joining hollow covers or hollow bottoms to open ends of container bodies
• CPC Class Codes: B29C 66/8322 Joining or pressing tools reciprocating along one axis
• CPC Class Codes: B29C 66/92655 by using several stops
• CPC Class Codes: B29C 66/929 characterized by specific pressure, force, mechanical power or displacement values or ranges
• CPC Class Codes: B29L 2031/756 Microarticles, nanoarticles
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 2203/0338 Channels
• CPC Class Codes: B81C 1/00119 Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: B81C 2203/038 Bonding techniques not provided for in B81C2203/031 - B81C2203/037
• CPC Class Codes: B81C 3/001 Bonding of two components

Abstract

A method of manufacturing an ultrasonic welding-based microfluidic device, the method including: forming a bottom board having two welding stoppers formed right and left and having a certain height and a certain interval; forming a top board having two energy directors formed with an interval greater than the interval between the two welding stoppers; putting the top board on the bottom board to locate the energy directors at the outside of welding stoppers, respectively; and welding the top board to the bottom board by using ultrasonic welding, wherein a channel is formed between the two welding stoppers without additional energy directors. Accordingly, it is possible to prevent a phenomenon that a fluid irregularly flows due to an uneven surface formed on a side of the channel while the energy directors are melted.

Claims

1. An ultrasonic welding-based microfluidic device comprising:

a bottom board having two welding stoppers formed right and left with a certain height and a certain interval;

a top board having two energy directors formed having an interval greater than interval between the welding stoppers, located at each of two welding stoppers, and welded to the bottom board while ultrasonic welding; and

a channel formed between the two welding stoppers as the bottom board is bonded to the top board by the ultrasonic welding.

2. The ultrasonic welding-based microfluidic device of claim 1, wherein the bottom board has two grooves deeply hollowed in right and left of the channels between the two welding stoppers.

3. The ultrasonic welding-based microfluidic device of claim 2, wherein the channel comprises deep channels that are two grooves and a shallow channel formed between the two grooves.

4. The ultrasonic welding-based microfluidic device of claim 3, wherein the shallow channel acts as a real channel, and

a width of the channel is determined according to a width of the shallow channel.

5. The ultrasonic welding-based microfluidic device of claim 3, wherein the channel, when a fluid is injected, is suddenly expanded due to a difference between depths of the deep channel and the shallow channel.

6. A method of manufacturing an ultrasonic welding-based microfluidic device, the method comprising:

forming a bottom board having two welding stoppers formed right and left and having a certain height and a certain interval;

forming a top board having two energy directors formed with an interval greater than the interval between the two welding stoppers;

putting the top board on the bottom board to locate the energy directors at the outside of welding stoppers, respectively; and

welding the top board to the bottom board by using ultrasonic welding,

wherein a channel, through which a fluid passes, is formed between the two welding stoppers as the top board is welded to the bottom board.

7. The method of claim 6, further comprising forming two grooves deeply hollowed right and left of the channel formed between the two welding stoppers while forming the bottom board.

8. The method of claim 6, wherein, in the welding the top board to the bottom board, ultrasonic energy is intensively applied to the two energy directors for a short time to melt the two energy directors, thereby welding the top board to the bottom board

9. The method of claim 7, wherein the channel comprises deep channels that are two grooves and a shallow channel formed between the two grooves.

10. The ultrasonic welding-based microfluidic device of claim 9, wherein the shallow channel acts as a real channel, and

a width of the channel is determined according to a width of the shallow channel.

11. The ultrasonic welding-based microfluidic device of claim 9, wherein the channel, when a fluid is injected, is suddenly expanded due to a difference between depths of the deep channel and the shallow channel.