LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same
First Claim
1. A method of making an LED chip package structure with high-efficiency light emission by rough surfaces, comprising:
- providing a substrate unit, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body;
arranging a plurality of LED chips on the substrate body by a matrix method to form a plurality of longitudinal LED chip rows, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit;
longitudinally and respectively covering the longitudinal LED chip rows with a plurality of longitudinal package colloids using a first mold unit, wherein each longitudinal package colloid has a plurality of cambered colloid surfaces that are formed on its top side and correspond to the LED chips;
transversely cutting the longitudinal package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covering the corresponding LED chips, wherein the top surface of each package colloid is the cambered colloid surface;
respectively covering and filling a frame unit on the substrate body, on the package colloids, and between each two adjacent package colloids using a second mold unit; and
transversely cutting the frame unit, the package colloids and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each package colloid is cut into two half package colloids, each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface formed in front of its cambered colloid surface, and each light bar has a frame layer for exposing the rough light-emitting colloid surfaces of the half package colloids.
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Abstract
An LED chip package structure with high-efficiency light emission by rough surfaces includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covering the LED chips. Each package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof.
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Citations
41 Claims
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1. A method of making an LED chip package structure with high-efficiency light emission by rough surfaces, comprising:
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providing a substrate unit, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body; arranging a plurality of LED chips on the substrate body by a matrix method to form a plurality of longitudinal LED chip rows, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; longitudinally and respectively covering the longitudinal LED chip rows with a plurality of longitudinal package colloids using a first mold unit, wherein each longitudinal package colloid has a plurality of cambered colloid surfaces that are formed on its top side and correspond to the LED chips; transversely cutting the longitudinal package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covering the corresponding LED chips, wherein the top surface of each package colloid is the cambered colloid surface; respectively covering and filling a frame unit on the substrate body, on the package colloids, and between each two adjacent package colloids using a second mold unit; and transversely cutting the frame unit, the package colloids and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each package colloid is cut into two half package colloids, each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface formed in front of its cambered colloid surface, and each light bar has a frame layer for exposing the rough light-emitting colloid surfaces of the half package colloids. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of making an LED chip package structure with high-efficiency light emission by rough surfaces, comprising:
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providing a substrate unit, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body; arranging a plurality of LED chips on the substrate body by a matrix method to form a plurality of longitudinal LED chip rows, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; longitudinally and respectively covering the longitudinal LED chip rows with a plurality of longitudinal package colloids using a first mold unit, wherein each longitudinal package colloid has a plurality of cambered colloid surfaces that are formed on its top side and correspond to the LED chips; transversely cutting the longitudinal package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covering the corresponding LED chips, wherein the top surface of each package colloid is the cambered colloid surface; respectively, longitudinally covering and filling a plurality of longitudinal frame layers on the substrate body, on the package colloids, and between each two longitudinal and adjacent package colloids via a third mold unit; and transversely cutting the longitudinal frame layers, the package colloids and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each package colloid is cut into two half package colloids, each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface formed in front of its cambered colloid surface, and each light bar has a frame layer for exposing the rough light-emitting colloid surfaces of the half package colloids. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. An LED chip package structure with high-efficiency light emission by rough surfaces, comprising:
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a substrate unit having a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body; a light-emitting unit having a plurality of LED chips arranged on the substrate body, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit; and a package colloid unit having a plurality of half package colloids respectively covering the LED chips, wherein each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification