×

LED chip package structure with high-efficiency light emission by rough surfaces and method of making the same

  • US 20090152570A1
  • Filed: 09/25/2008
  • Published: 06/18/2009
  • Est. Priority Date: 12/12/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method of making an LED chip package structure with high-efficiency light emission by rough surfaces, comprising:

  • providing a substrate unit, wherein the substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body;

    arranging a plurality of LED chips on the substrate body by a matrix method to form a plurality of longitudinal LED chip rows, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit;

    longitudinally and respectively covering the longitudinal LED chip rows with a plurality of longitudinal package colloids using a first mold unit, wherein each longitudinal package colloid has a plurality of cambered colloid surfaces that are formed on its top side and correspond to the LED chips;

    transversely cutting the longitudinal package colloids along a line between each two adjacent and longitudinal LED chips to form a plurality of package colloids that are separated from each other and respectively covering the corresponding LED chips, wherein the top surface of each package colloid is the cambered colloid surface;

    respectively covering and filling a frame unit on the substrate body, on the package colloids, and between each two adjacent package colloids using a second mold unit; and

    transversely cutting the frame unit, the package colloids and the substrate body along a line between each two adjacent and longitudinal LED chips to form a plurality of light bars, wherein each package colloid is cut into two half package colloids, each half package colloid has a half cambered colloid surface and a rough light-emitting colloid surface formed in front of its cambered colloid surface, and each light bar has a frame layer for exposing the rough light-emitting colloid surfaces of the half package colloids.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×