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Textured encapsulant surface in LED packages

  • US 20090152573A1
  • Filed: 12/14/2007
  • Published: 06/18/2009
  • Est. Priority Date: 12/14/2007
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) device, comprising:

  • at least one LED chip disposed on a mount surface; and

    an encapsulant disposed proximate to said mount surface, said encapsulant comprising a textured emission surface that is substantially conformal with said mount surface.

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