Textured encapsulant surface in LED packages
First Claim
1. A light emitting diode (LED) device, comprising:
- at least one LED chip disposed on a mount surface; and
an encapsulant disposed proximate to said mount surface, said encapsulant comprising a textured emission surface that is substantially conformal with said mount surface.
4 Assignments
0 Petitions
Accused Products
Abstract
A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
146 Citations
49 Claims
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1. A light emitting diode (LED) device, comprising:
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at least one LED chip disposed on a mount surface; and an encapsulant disposed proximate to said mount surface, said encapsulant comprising a textured emission surface that is substantially conformal with said mount surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A chip-scale package light emitting diode (LED) device, comprising:
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a mount surface; a plurality of LEDs disposed on said mount surface; an encapsulant having an emission surface that is substantially parallel to said mount surface, said emission surface textured to create a plurality of roughening surface features. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A method of fabricating a light emitting diode (LED) device, comprising:
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providing a mount surface; disposing at least one LED chip on said mount surface; depositing an encapsulant having an emission surface on said at least one LED chip; shaping said encapsulant such that said emission surface is textured; and curing said encapsulant. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49)
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Specification