FABRICATING METHODS OF PHOTOELECTRIC DEVICES AND PACKAGE STRUCTURES THEREOF

• US 20090152665A1
• Filed: 12/11/2008
• Published: 06/18/2009
• Est. Priority Date: 12/14/2007
• Status: Abandoned Application

• Current Assignee: Advanced Optoelectronic Technology, Inc.
• Original Assignee: Advanced Optoelectronic Technology, Inc.
• Inventors: Tseng, Wen Liang, Chen, Lung Hsin
• Application Number:
  US12/332,744
• Publication Number:
  US 20090152665A1
• Time in Patent Office: Days
• US Class Current: 257/461
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The invention discloses a method for fabricating a photoelectric device. A ceramic substrate is first provided, and then a first patterned electrode and a second patterned electrode are formed on and underneath the surface of the ceramic substrate. A plurality of photoelectric devices is sequentially connected to the first electrode layer with a wire solder or a eutectic joint method. The encapsulation materials cover the each photoelectric die to prevent damaged from the external force or environment. Cutting the ceramic substrate along the spaces between the photoelectric dies forms a plurality of independent package units.

Claims

1. A fabrication method for photoelectric devices, comprising the steps of:

providing a ceramic substrate;

forming a first patterned electrode layer and a second patterned electrode on the two surfaces of the ceramic substrate respectively;

electrically connecting a plurality of photoelectric dies to the first patterned electrode layer with a eutectic joint procedure respectively;

covering the photoelectric dies with an encapsulation material; and

forming a plurality of independent package units by cutting the ceramic substrate along the spaces between the photoelectric dies.

2. The fabrication method of claim 1, wherein the ceramic comprises a plurality of opening holes, and a vertical conductive part is formed in each of the opening holes after forming the first patterned electrode layer and the second patterned electrode respectively.

3. The fabrication method of claim 2, further comprising a step of forming a plurality of vertical conductive parts with a silver dipping method or a barrel plating method, wherein the first patterned electrode layer electrically is connected to the second patterned electrode by the vertical conductive parts.

4. The fabrication method of claim 1, wherein the ceramic substrate comprises a plurality of cutting lines so that a plurality of independent package units are formed by cutting, peeling, or snapping with a diamond knife along the cutting lines.

5. The fabrication method of claim 4, wherein the cutting lines are formed with a LASER or a mold pressing.

6. The fabrication method of claim 1, wherein a flip chip method is utilized for the eutectic joint procedure.

7. The fabrication method of claim 1, wherein the encapsulation material comprises a thermoplastic or a thermosetting polymeric material.

8. The fabrication method of claim 7, wherein the thermosetting polymeric material includes resins and silica gels.

9. The fabrication method of claim 1, wherein the first patterned electrode layer and the second patterned electrode comprise a plurality of N-type electrodes and a plurality of P-type electrodes respectively.

10. A package structure for photoelectric device, comprising:

a ceramic substrate;

a first electrode layer disposed on the upper surface of the ceramic substrate;

a second electrode layer disposed on the underneath surface of the ceramic substrate;

a photoelectric die mounted on the first electrode layer;

an encapsulation material covering the photoelectric die; and

a plurality of vertical conductive parts electrically connected to the first electrode layer and the second electrode layer.

11. The package structure of claim 10, wherein the ceramic substrate comprises AlN, BeO, SiC, glass, Al, or diamond.

12. The package structure of claim 10, wherein the photoelectric die is a light emitting diode die.

13. The package structure of claim 10, wherein the first electrode layer and the second electrode layer comprise at least one N-type electrode and at least one P-type electrode respectively.

14. The package structure of claim 13, wherein one of the vertical conductive parts is electrically connected to the N-type electrode of the first electrode layer and the N-type electrode of the second electrode layer, and another one of the vertical conductive parts is electrically connected to the P-type electrode of the first electrode layer and the P-type electrode of the second electrode layer.

15. The package structure of claim 10, wherein the ceramic substrate further comprises a plurality of opening holes and each of the vertical conductive parts is disposed in each of the opening holes.

16. The package structure of claim 10, wherein the vertical conductive parts are disposed on the sides of the ceramic substrate.

17. The package structure of claim 10, wherein the photoelectric die and the first electrode layer are eutectic jointed by a plurality of bumps.

18. A package structure for photoelectric device, comprising:

a substrate comprising an insulation layer, wherein the material of the insulation layer is ceramic material;

a photoelectric device mounted on one surface of the substrate; and

an electronic device mounted on the other surface which is opposite to the surface on which the photoelectric device is mounted electrically coupled to the photoelectric device.

19. The package structure of claim 18, wherein the photoelectric device is a light emitting diode, a LASER diode or a photo-receiver, and the photoelectric device is mounted on the substrate by a wire bonding method or a flip chip method.

20. The package structure of claim 19, wherein the electronic device is an electrostatic protection device, an electronic passive device, a diode or a transistor, and the electronic device is mounted on the substrate by a wire bonding method or a flip chip method.