SEMICONDUCTOR DEVICE
First Claim
1. Leadframe for a semi-conductor device, comprising a die pad for mounting a semi-conductor die and a plurality of leads for connection with the semi-conductor die, the leads being arranged at a distance from the die pad;
- wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds;
wherein, at least one location between the die attachment surface portion and the downbond attachment surface portion, the top surface of the die pad has at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion.
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0 Petitions
Accused Products
Abstract
A semi-conductor device (100) comprises an exposed leadframe (10) with a die pad (11) and a plurality of leads (12). The die pad (11) has a substantially flat bottom surface (14) and a top surface (15). A semi-conductor die (2) is attached to a die attachment portion (31) of the top surface (15). Downbonds (5) connect the die (2) to a downbond attachment portion (32). Standard bonds (4) connect the die (2) to the leads (12). A plastic package (6) encapsulates the die (2), the standard bonds (4) and the downbonds (5). The top surface of the die pad has portions located at different levels, and step-shaped transitions between two adjacent ones of such portions. At least one of such step-shaped transition (36) is located between the die (2) and the downbonds (5). It has been found that such step-shaped transition provides good protection against downbond failure.
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Citations
21 Claims
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1. Leadframe for a semi-conductor device, comprising a die pad for mounting a semi-conductor die and a plurality of leads for connection with the semi-conductor die, the leads being arranged at a distance from the die pad;
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wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds; wherein, at least one location between the die attachment surface portion and the downbond attachment surface portion, the top surface of the die pad has at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 18)
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17. Semi-conductor device, comprising:
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a leadframe comprising a die pad for mounting a semi-conductor die and a plurality of leads for connection with the semi-conductor die, the leads being arranged at a distance from the die pad; wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds; wherein, at least one location between the die attachment surface portion and the downbond attachment surface portion, the top surface of the die pad has at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion; a semi-conductor die attached to the die attachment portion of the die pad, the semi-conductor die comprising an integrated circuit; a plurality of standard bonds connecting said integrated circuit to respective leads; a plurality of downbonds connecting said integrated circuit to the downbond attachment portion of the die pad; and a plastic package encapsulating at least the semi-conductor die, the standard bonds and the downbonds. - View Dependent Claims (19)
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20. Method for manufacturing a semi-conductor device, the method comprising the steps of:
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providing a base leadframe strip; using an etching process, defining at least one leadframe, comprising a die pad and a plurality of leads, wherein the die pad has a substantially flat bottom surface and a top surface, the top surface having a die attachment portion and a downbond attachment portion for connecting downbonds; using an etching process, etching away at least a portion of the top surface of the die pad, at least one location between the die attachment surface portion and the downbond attachment surface portion, to define at least one third surface portion that is out-of-plane with the die attachment surface portion, and at least one substantially step-shaped surface transition between the die attachment surface portion and said third surface portion; attaching a semi-conductor die to the die attachment portion of the die pad, the semi-conductor die comprising an integrated circuit; connecting standard bonds to said integrated circuit and to respective leads; connecting downbonds to said integrated circuit and to the downbond attachment portion of the die pad; applying molten plastic material on the top surface of the die pad, for encapsulating at least the semi-conductor die, the standard bonds and the downbonds. - View Dependent Claims (21)
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Specification