METHOD AND SYSTEM FOR FILTERS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE

• US 20090152739A1
• Filed: 12/13/2007
• Published: 06/18/2009
• Est. Priority Date: 12/13/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Granted Patent: US 8,134,425 B2
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/1903 including wave guides
• CPC Class Codes: H01L 2924/19051 Impedance matching structure [e.g. balun]
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

Methods and systems for filters embedded in an integrated circuit package are disclosed and may include controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to the integrated circuit. The one or more filter components may be electrically coupled to one or more switchable capacitors within the integrated circuit. The filter components may include transmission line devices, microstrip filters, transformers, surface mount devices, inductors, and/or coplanar waveguide filters. The filter components may be fabricated utilizing metal conductive layers and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package. The integrated circuit may be electrically coupled to the multi-layer package utilizing a flip-chip bonding technique.

Claims

1. A method for enabling communication, the method comprising:

controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to said integrated circuit, wherein said one or more filter components are electrically coupled to one or more switchable capacitors within said integrated circuit.

2. The method according to claim 1, wherein said filter components comprise transmission line devices.

3. The method according to claim 1, wherein said filter components comprise microstrip filters.

4. The method according to claim 1, wherein said filter components comprise transformers.

5. The method according to claim 1, wherein said filter components comprise surface mount devices.

6. The method according to claim 1, wherein said filter components comprise inductors.

7. The method according to claim 1, wherein said filter components comprise coplanar waveguide filters.

8. The method according to claim 1, comprising fabricating said filter components utilizing metal conductive layers deposited on and/or embedded within said multi-layer package.

9. The method according to claim 1, wherein said filter components comprise ferromagnetic layers deposited on and/or embedded within said multi-layer package.

10. The method according to claim 1, wherein said integrated circuit is electrically coupled to said multi-layer package utilizing a flip-chip bonding technique.

11. A system for enabling communication, the system comprising:

a multi-layer package comprising integrated filter components, wherein said filter components are electrically coupled to one or more switchable capacitors in an integrated circuit, said multilayer package is bonded to said integrated circuit, and said multi-layer package and/or said integrated circuit enables filtering of signals.

12. The system according to claim 11, wherein said filter components comprise transmission line devices.

13. The system according to claim 11, wherein said filter components comprise microstrip filters.

14. The system according to claim 11, wherein said filter components comprise transformers.

15. The system according to claim 11, wherein said filter components comprise surface mount devices.

16. The system according to claim 11, wherein said filter components comprise inductors.

17. The system according to claim 11, wherein said filter components comprise coplanar waveguide filters.

18. The system according to claim 11, wherein said filter components comprise coplanar waveguide filters.

19. The system according to claim 11, wherein said filter components comprise metal conductive layers deposited on and/or embedded within said multi-layer package.

20. The system according to claim 11, wherein said integrated circuit is electrically coupled to said multi-layer package utilizing a flip-chip technique.