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RF INTEGRATED CIRCUIT TEST METHODOLOGY AND SYSTEM

  • US 20090153158A1
  • Filed: 03/31/2008
  • Published: 06/18/2009
  • Est. Priority Date: 12/18/2007
  • Status: Active Grant
First Claim
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1. A system for testing a microelectronic die or package/module device under test (DUT) that has an integrated millimeter wave antenna, comprising:

  • an interface printed wiring board having a first face to face the integrated antenna of the DUT and a plurality of contact points that are to contact matching ones of the DUT itself or of a connection board onto which the DUT has been installed, to transmit and/or receive signals for testing the DUT; and

    a test antenna being adapted to receive and/or transmit millimeter wave radiation, from and/or to the integrated antenna of the DUT.

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