METHOD AND SYSTEM FOR AN INTEGRATED ANTENNA AND ANTENNA MANAGEMENT
First Claim
1. A method for signal processing, the method comprising:
- tuning one or more reactances in a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, wherein said reactances are coupled to an antenna; and
transmitting and/or receiving signals via said antenna based on said tuning.
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Accused Products
Abstract
Aspects of a method and system for an integrated antenna and antenna management are provided. In this regard, one or more reactances coupled to an antenna in a hybrid circuit may be tuned and signals may be transmitted and/or received based on the tuning. The hybrid circuit may comprise an integrated circuit (IC) bonded to a multi-layer package. The antenna may be embedded within and/or on the multi-layer package. The reactances may be within and/or on the IC and/or the multi-layer package. In this regard, the IC may be bonded to or mounted to an underside of the multi-layer package. The reactances may be tuned via one or more switching elements and/or logic, circuitry, and/or code within the IC. The reactances may comprise one or more inductors and/or capacitor arrays. The multi-layer package may comprise one or more layers of ferromagnetic and/or ferrimagnetic material.
141 Citations
21 Claims
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1. A method for signal processing, the method comprising:
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tuning one or more reactances in a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, wherein said reactances are coupled to an antenna; and transmitting and/or receiving signals via said antenna based on said tuning. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 16, 17, 18, 19, 20, 21)
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12. A system for signal processing, the system comprising:
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a hybrid circuit comprising an integrated circuit bonded to a multi-layer package; said hybrid circuit being enabled to tune one or more reactances within and/or on said integrated circuit and/or said multi-layer package; and said hybrid circuit being enabled to transmit and/or receive signals via one or more antennas within and/or on said integrated circuit and/or said multi-layer package. - View Dependent Claims (13)
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14. The system according to claim 14, wherein said integrated circuit is mounted to an underside of said multi-layer package.
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15. The system according to claim 15, wherein said one or more reactances are tuned via logic, circuitry, and/or code within said integrated circuit.
Specification