METHOD AND SYSTEM FOR AN INTEGRATED ANTENNA AND ANTENNA MANAGEMENT

• US 20090153421A1
• Filed: 12/12/2007
• Published: 06/18/2009
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Maryam, Rofougaran, Ahmadreza
• Granted Patent: US 8,106,829 B2
• Time in Patent Office: Days
• US Class Current: 343/745
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Abstract

Aspects of a method and system for an integrated antenna and antenna management are provided. In this regard, one or more reactances coupled to an antenna in a hybrid circuit may be tuned and signals may be transmitted and/or received based on the tuning. The hybrid circuit may comprise an integrated circuit (IC) bonded to a multi-layer package. The antenna may be embedded within and/or on the multi-layer package. The reactances may be within and/or on the IC and/or the multi-layer package. In this regard, the IC may be bonded to or mounted to an underside of the multi-layer package. The reactances may be tuned via one or more switching elements and/or logic, circuitry, and/or code within the IC. The reactances may comprise one or more inductors and/or capacitor arrays. The multi-layer package may comprise one or more layers of ferromagnetic and/or ferrimagnetic material.

Claims

1. A method for signal processing, the method comprising:

tuning one or more reactances in a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, wherein said reactances are coupled to an antenna; and

transmitting and/or receiving signals via said antenna based on said tuning.

2. The method according to claim 1, wherein said one or more reactances are within and/or on said multi-layer package, and/or within said integrated circuit.

3. The method according to claim 2, wherein said reactances within and/or on said integrated circuit package are coupled to said integrated circuit via one or more solder balls.

4. The method according to claim 3, wherein said integrated circuit is mounted to an underside of said multi-layer package.

5. The method according to claim 4, comprising tuning said one or more reactances via logic, circuitry, and/or code within said integrated circuit.

6. The method according to claim 1, comprising tuning said one or more reactances via one or more switching elements.

7. The method according to claim 6, wherein said switching elements comprise a micro-electro-mechanical systems (MEMS) switch in and/or on said integrated circuit and/or said multi-layer package.

8. The method according to claim 1, wherein said reactances comprise one or more inductors in and/or on said integrated circuit and/or said multi-layer package.

9. The method according to claim 1, wherein said reactances comprise one or more capacitor arrays.

10. The method according to claim 1, wherein said multi-layer package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.

11. The method according to claim 1, wherein said antenna is in and/or on said multi-layer package.

16. The system according to claim 1, wherein said one or more reactances are tuned via one or more switching elements.

17. The system according to claim 6, wherein said switching elements comprise a micro-electro-mechanical systems (MEMS) switch in and/or on said integrated circuit and/or said multi-layer package.

18. The system according to claim 1, wherein said reactances comprise one or more inductors in and/or on said integrated circuit and/or said multi-layer package.

19. The system according to claim 1, wherein said reactances comprise one or more capacitor arrays.

20. The system according to claim 1, wherein said multi-layer package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.

21. The system according to claim 1, wherein said antenna is in and/or on said multi-layer package.

12. A system for signal processing, the system comprising:

a hybrid circuit comprising an integrated circuit bonded to a multi-layer package;

said hybrid circuit being enabled to tune one or more reactances within and/or on said integrated circuit and/or said multi-layer package; and

said hybrid circuit being enabled to transmit and/or receive signals via one or more antennas within and/or on said integrated circuit and/or said multi-layer package.

13. The system according to claim 12, wherein said reactances within and/or on said integrated circuit package are coupled to said integrated circuit via one or more solder balls.

14. The system according to claim 14, wherein said integrated circuit is mounted to an underside of said multi-layer package.

15. The system according to claim 15, wherein said one or more reactances are tuned via logic, circuitry, and/or code within said integrated circuit.