METHOD AND SYSTEM FOR CONFIGURABLE ANTENNA IN AN INTEGRATED CIRCUIT PACKAGE

• US 20090153427A1
• Filed: 12/12/2007
• Published: 06/18/2009
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 7,911,388 B2
• Time in Patent Office: Days
• US Class Current: 343/787
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01Q 21/064 using horn or slot aerials slotted waveguides arrays H01Q21/005
• CPC Class Codes: H01Q 3/24 varying the orientation by switching energy from one active radiating element to another, e.g. for beam switching

Abstract

Aspects of a method and system for a configurable antenna in an integrated circuit package are provided. In a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, one or more antenna parameters may be adjusted by configuring a plurality of antenna elements via one or more switching elements. In this regard, the antenna elements and/or the switching elements may be within and/or on the multi-layer package and/or within the integrated circuit. The switching elements may be MEMS switches on and/or within the IC and/or the multi-layer package. The IC may be bonded or mounted to the underside of the package and signals may be communicated between the IC and the package via one or more solder balls. The IC may comprise suitable logic, circuitry, and/or code for configuring the antenna elements. The antenna elements may be configured based on desired polarization, antenna gain, and/or frequency.

Claims

1. A method for signal processing, the method comprising:

adjusting, in a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, one or more antenna parameters by configuring a plurality of antenna elements via one or more switching elements, wherein said integrated circuit and/or said multi-layer package comprises said plurality of antenna elements and/or said one or more switching elements.

2. The method according to claim 1, wherein said switching elements are micro-electro-mechanical switches within and/or on said integrated circuit and/or said multi-layer package.

3. The method according to claim 1, comprising coupling said antenna elements in said multi-layer package to said integrated circuit via one or more solder balls.

4. The method according to claim 2, wherein said integrated circuit is mounted to the underside of said multi-layer package.

5. The method according to claim 4, configuring said antenna elements via logic, circuitry, and/or code in said integrated circuit.

6. The method according to claim 1, comprising configuring said antenna elements based on a desired polarization of received and/or transmitted signals.

7. The method according to claim 1, comprising configuring said antenna elements based on a desired antenna gain.

8. The method according to claim 1, comprising configuring said antenna elements based on a desired frequency band of received and/or transmitted signals.

9. The method according to claim 1, comprising utilizing a first configuration of said antenna elements for receiving signals and utilizing a second configuration of said antenna elements for transmitting signals.

10. The method according to claim 1, wherein said integrated circuit package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.

11. A system for signal processing, the system comprising:

a hybrid circuit comprising an integrated circuit bonded to a multi-layer package; and

said hybrid circuit being enabled to adjust one or more antenna parameters by configuring a plurality of antenna elements via one or more switching elements, wherein said plurality of antenna elements and/or said one or more switching elements are within and/or on said multi-layer package, and/or within said integrated circuit.

12. The system according to claim 11, wherein said switching elements are micro-electro-mechanical switches within and/or on said integrated circuit and/or said multi-layer package.

13. The system according to claim 11, wherein said antenna elements in said multi-layer package are coupled to said integrated circuit via one or more solder balls.

14. The system according to claim 12, wherein said integrated circuit is mounted to the underside of said multi-layer package.

15. The system according to claim 14, wherein said integrated circuit comprises suitable logic, circuitry, and/or code for configuring said antenna elements.

16. The system according to claim 11, wherein said antenna elements are configured based on a desired polarization of received and/or transmitted signals.

17. The system according to claim 11, wherein said antenna elements are configured based a desired antenna gain.

18. The system according to claim 11, wherein said antenna elements are configured based a desired frequency band of received and/or transmitted signals.

19. The system according to claim 11, wherein a first configuration of said antenna elements is utilized receiving signals and a second configuration of said antenna elements is utilized for transmitting signals.

20. The system according to claim 11, wherein said integrated circuit package comprises one or more layers of ferromagnetic and/or ferrimagnetic material.