MULTIPLE CHUCK SCANNING STAGE

• US 20090153824A1
• Filed: 12/17/2007
• Published: 06/18/2009
• Est. Priority Date: 12/17/2007
• Status: Abandoned Application

• Current Assignee: KLA-Tencor Corporation (KLA Corporation)
• Original Assignee: KLA-Tencor Corporation (KLA Corporation)
• Inventors: BALAN, AVIV
• Application Number:
  US11/958,201
• Publication Number:
  US 20090153824A1
• Time in Patent Office: Days
• US Class Current: 355/67
• CPC Class Codes: G03B 27/42 for automatic sequential copying of the same original G03B27/34, G03B27/53 take precedence
• CPC Class Codes: G03B 27/54 Lamp housings; Illuminating means

Abstract

A substrate processing system and method are disclosed. The system may include a stage, first and second chucks mounted on the stage and at least one processing head proximate the stage. The stage and processing head are configured for relative movement for a sufficient distance for the processing head to process both the first and second test substrates. According to the substrate processing method first and second substrates may be disposed on chucks mounted to a stage. The stage and a processing head may move relative to each other in a first direction along a first axis for a first distance that is sufficient for a substrate processing head to scan across the substrates, then move relative to each other along a direction nonparallel to the first direction for a second distance, and then move relative each other opposite the first direction for a distance sufficient for the head to scan across the substrates. The processing head may process the first and second substrates at one or more locations along the first distance and/or third distance.

Claims

1. A substrate processing system, comprising:

a stage;

first and second chucks mounted on the stage, wherein the first and second chucks are adapted to hold first and second substrates; and

at least one substrate processing head positioned proximate the stage adapted to process the first and second substrates,

wherein the stage and processing head are configured for relative movement for a sufficient distance for the processing head to process both the first and second test substrates.

2. The system of claim 1, wherein the first and second chucks are adapted to move independently with respect to a vertical axis.

3. The system of claim 2, wherein the first and second chucks area adapted to tip and/or tilt with respect to the vertical axis.

4. The system of claim 1 wherein the stage or processing head is adapted to move with respect to a vertical axis.

5. The system of claim 1, wherein one or more of the first and second chucks are adapted to rotate independently about a rotation axis.

6. The system of claim 1 further comprising a movement mechanism adapted to move the stage along one or more scanning axes with respect to the processing head.

7. The system of claim 1 further comprising a movement mechanism adapted to move at least one of the stage and processing head with respect to one another.

8. The system of claim 6 wherein the processing head is an optical head.

9. The system of claim 8, further comprising a focusing mechanism operably coupled to the optical head, wherein the focusing mechanism is adapted to adjust a focus of the optical head on the first or second wafers during the scanning.

10. The system of claim 8, further comprising a controller operably coupled to the focusing mechanism and the movement mechanism, wherein the controller is adapted to control the movement of the stage and/or the optical head in response to a signal from the focusing mechanism in a direction parallel to an optical axis of the optical head.

11. The system of claim 1 wherein at least one of the first chuck and the second chuck is configured to move relative to the stage independently of the other of the first chuck and the second chuck for a distance sufficient to compensate for an offset in placement of substrates on the first chuck and the second chuck.

12. The system of claim 1 further comprising at least one robot configured to load and unload the first and second substrate.

13. The system of claim 12 wherein the at least one robot includes a first robot and a second robot, wherein the first and second robots are configured to load and unload substrates on the first chuck and the second chuck at the same time.

14. The system of claim 1, wherein the stage is configured to move relative to the processing head.

15. The system of claim 1, wherein the processing head is configured to move relative to the stage.

16. The system of claim 1 wherein the processing head and stage are configured to move relative to each other.

17. The system of claim 16, wherein the stage is configured to:

move relative to the optical head in a first direction along a first axis for a first distance that is sufficient for the processing head to scan across both the first and second substrates;

move relative to the optical head along a direction nonparallel to the first direction for a second distance;

move relative to the optical head in a third direction that is opposite the first direction for a third distance that is sufficient for the processing head to scan across both the first and second substrates.

18. The system of claim 1, wherein the at least one processing head includes two or more processing heads.

19. An substrate processing method, comprising:

disposing first and second substrates on first and second chucks mounted to a stage;

moving the stage and a single processing head relative to each other in a first direction along a first axis for a first distance that is sufficient for the optical head to scan across both the first and second substrates;

moving the stage and the single processing head relative to each other along a direction nonparallel to the first direction for a second distance;

moving the stage and the single processing head relative each other in a third direction that is opposite the first direction for a third distance that is sufficient for the optical head to scan across both the first and second substrates; and

processing the first and second substrates with the processing head at one or more locations along the first distance and/or third distance.

20. The method of claim 19, further comprising moving the first or second chuck in a vertical direction relative to the processing head.

21. The method of claim 19 wherein moving the first or second chucks in the vertical direction comprises moving one of the first and second chuck vertically independently of the other of the first and second chuck.

22. The method of claim 19 wherein the second distance is less than or equal to a width of a field of view of the optical head.

23. The method of claim 19 wherein moving the stage and the single optical head relative to each other comprises moving the stage while keeping the optical head fixed.

24. The method of claim 19 wherein moving the stage and the single optical head relative to each other comprises moving the optical head while keeping the stage fixed.

25. The method of claim 19 wherein moving the stage and the single optical head relative to each other comprises moving both the optical head and the stage relative to each other.