HEAT DISSIPATING STRUCTURE OF 1U POWER SUPPLY

• US 20090154090A1
• Filed: 12/12/2007
• Published: 06/18/2009
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Zippy Technology Corporation
• Original Assignee: Zippy Technology Corporation
• Inventors: SU, Chun-Lung
• Granted Patent: US 7,675,749 B2
• Time in Patent Office: Days
• US Class Current: 361/679.490
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components

Abstract

A heat dissipating structure of a 1 U power supply is installed in an industrial computer host system of a universal standard specification 1 U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1 U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk.

Claims

1. A heat dissipating structure of a 1 U power supply, installed in an industrial computer host system of a universal standard specification 1 U for supplying electric power, characterized in that:

at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and the interior of the power supply disposed at a section of the retaining plane includes at least one fan, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage for guiding the heat dissipated airflow of the fan.

2. The heat dissipating structure of the 1 U power supply as recited in claim 1, wherein the fan and the power supply are of the same height, and the power supply includes a containing hole for installing the fan.

3. The heat dissipating structure of the 1 U power supply as recited in claim 1, wherein the heat dissipating hole disposed on the heat dissipating plane is extended to the power supply panel.

4. The heat dissipating structure of the 1 U power supply as recited in claim 1, wherein the heat dissipating plane includes a reinforced element protruded thereon and having a height equal to the retaining plane.

5. The heat dissipating structure of the 1 U power supply as recited in claim 1, wherein the heat dissipating plane is defined by coupling a separating element with the power supply.

6. The heat dissipating structure of the 1 U power supply as recited in claim 1, wherein the height difference is preferably disposed at an upper wall of the power supply.

7. The heat dissipating structure of the 1 U power supply as recited in claim 6, wherein the height difference is disposed at the two walls or a bottom wall, and the heat dissipating holes of adjacent walls are a continuous curved hole.