METHOD FOR PACKAGING LED DEVICE

• US 20090155937A1
• Filed: 12/12/2008
• Published: 06/18/2009
• Est. Priority Date: 12/12/2007
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: TSOU, Wen-Chieh
• Granted Patent: US 7,772,019 B2
• Time in Patent Office: Days
• US Class Current: 438/26
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method for packaging LED device comprises following steps: (1) A substrate with a cavity is provided; (2) A electrode layer is formed and located on the cavity and the surface of the substrate; (3) A opening through the cavity is formed, whereby a anode and a cathode are separated by the opening; (4) A LED chip is disposed on the bottom of the cavity and the opening, where the led chip is electrically connected to the anode and the cathode; (5) The cavity with the opening is filled with packaging material; (6) The packaging material is hardened, thereby the hardened packaging material with a recess that corresponding to the top of the chip; and (7) The LED device is formed by performing a cutting process along a cutting line in the cavity.

Claims

1. A method for packaging LED device, comprising:

providing a substrate having a cavity;

forming an electrode layer on the cavity and a surface of the substrate;

forming an opening on a bottom surface of the cavity, the opening divided the electrode layer into an anode area and a cathode area;

disposing a LED die on the bottom surface of the cavity and being across the opening, and the LED die electrically connected to the anode and the cathode;

filling an packaging material in the cavity and the opening;

curing the packaging material, wherein the cured packaging material comprises a recess correspondingly formed above the LED die; and

performing a cutting process along a cutting line in the cavity to form the LED device.

2. The method as claimed in claim 1, wherein the substrate comprises a first metal layer, a second metal layer and a gel layer, wherein the gel layer is formed between the first metal layer and the second metal layer.

3. The method as claimed in claim 2, further comprising:

forming an adhesive film adhered to the bottom surface of the substrate for preventing the packaging material is leaked from the opening.

4. The method as claimed in claim 3, further comprising:

providing a forming mold, wherein the forming mold comprises an upper mold and a lower mold, the substrate is disposed in the forming mold for performing a molding process.

5. The method as claimed in claim 4, wherein the upper mold is disposed on the electrode layer and the lower mold is disposed under the film.

6. The method as claimed in claim 5, wherein the upper mold comprises a nose, wherein the nose is disposed in the cavity and over the LED die.

7. The method as claimed in claim 1, further comprising:

removing the forming mold to from the recess of the packaging material after the step of hardening the packaging material so as to reduce the thickness of the packaging material on the LED die.

8. The method as claimed in claim 1, further comprising:

removing the adhesive film after or before the step of cutting process.