METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
First Claim
1. A method for manufacturing an electronic assembly comprising an electronic component, a cavity and a substrate, which method comprises;
- providing an electronic component having a first pattern with a substantially closed configuration;
providing a cover on a surface of the electronic component, which cover together with said surface defines a cavity, the closed configuration of the first pattern substantially enclosing the cover at said surface;
providing a substrate having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad;
disposing solder material at the solder pad;
positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface of the cover;
reflow-soldering the solder material, therewith providing a soldered connection between the first and second pattern.
13 Assignments
0 Petitions
Accused Products
Abstract
The present invention relates to a method for manufacturing an electronic assembly (50) comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component (10) having a first pattern with a substantially closed configuration; —providing a cover (18) on a surface of the electronic component, which cover together with said surface defines a cavity (20), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate (30) having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface (28) of the cover; —reflow-soldering the solder material, therewith providing a soldered connection (52) between the first and second pattern. Furthermore the present invention relates to an electronic assembly (50), a cover (18) and a substrate (30).
13 Citations
10 Claims
-
1. A method for manufacturing an electronic assembly comprising an electronic component, a cavity and a substrate, which method comprises;
-
providing an electronic component having a first pattern with a substantially closed configuration; providing a cover on a surface of the electronic component, which cover together with said surface defines a cavity, the closed configuration of the first pattern substantially enclosing the cover at said surface; providing a substrate having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; disposing solder material at the solder pad; positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface of the cover; reflow-soldering the solder material, therewith providing a soldered connection between the first and second pattern. - View Dependent Claims (2, 3, 4)
-
-
5. An electronic assembly comprising;
-
an electronic component, a cover disposed on a surface of the electronic component, a cavity located between the surface and the cover, and a first pattern disposed on said surface, which first pattern has a substantially closed configuration and has contact areas connected to electric contacts of the electronic component, which closed configuration substantially encloses the cover at said surface; a substrate, which supports a top surface of the cover and comprises a second pattern disposed on a surface of the substrate, which second pattern has a substantially closed configuration and has contact areas electrically connected to electric contacts of the substrate, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; a soldered connection between the first and second pattern. - View Dependent Claims (6, 7, 8, 9, 10)
-
Specification