CONTACTLESS POWER AND DATA TRANSFER SYSTEM AND METHOD
First Claim
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1. A system comprising:
- an encapsulated optoelectronic semiconductor device at least partly disposed within a barrier encapsulation; and
a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation.
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Abstract
A contactless power and data transfer system is disclosed. The system includes an encapsulated optoelectronic semiconductor device at least partly disposed within a barrier encapsulation, and a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation. A method for manufacturing a contactless power and data transfer system is also disclosed.
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Citations
37 Claims
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1. A system comprising:
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an encapsulated optoelectronic semiconductor device at least partly disposed within a barrier encapsulation; and a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A system comprising:
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an encapsulated planar optoelectronic semiconductor device at least partly disposed within a barrier encapsulation; and a contactless power transfer system configured to transfer at least one of power and data across the barrier encapsulation.
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34. A method of manufacturing an integrated contactless power transfer optoelectronic semiconductor device system comprising:
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providing an optoelectronic semiconductor device over a substrate; providing a first contactless power transfer element operably electrically coupled to the optoelectronic semiconductor device; providing a dielectric barrier encapsulation surrounding the optoelectronic semiconductor device and the first contactless power transfer element; and providing a second contactless power transfer element operably electrically coupled to a power source, external to the barrier encapsulation, and across from the first contactless power transfer element to form an integrated device. - View Dependent Claims (35, 36)
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37. A method of manufacturing a contactless power transfer optoelectronic semiconductor device system comprising:
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providing a first contactless power transfer element integrated with the optoelectronic semiconductor device and disposed internal to a barrier encapsulation; and providing a second contactless power transfer element disposed on a substrate and positioned external to the barrier encapsulation and disposed separately from the optoelectronic semiconductor device.
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Specification