Infrared Proximity Sensor Package with Reduced Crosstalk
First Claim
1. An infrared proximity sensor package, comprising:
- an infrared transmitter die;
an infrared receiver die;
a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses;
wherein the transmitter die is disposed in the first recess, the receiver die is disposed in the second recess, and at least the partitioning divider comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.
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0 Petitions
Accused Products
Abstract
Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter doe is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.
113 Citations
31 Claims
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1. An infrared proximity sensor package, comprising:
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an infrared transmitter die; an infrared receiver die; a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses; wherein the transmitter die is disposed in the first recess, the receiver die is disposed in the second recess, and at least the partitioning divider comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of making an infrared proximity sensor package, comprising:
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providing an infrared transmitter die; providing an infrared receiver die; providing a housing comprising outer sidewalls, a first recess, a second recess, and a partitioning divider disposed between the first recess and the second recess, at least the partitioning divider comprising liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein; positioning the transmitter die within the first recess, and positioning the receiver die within the second recess. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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Specification