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DOWNHOLE TOOL

  • US 20090160047A1
  • Filed: 12/21/2007
  • Published: 06/25/2009
  • Est. Priority Date: 12/21/2007
  • Status: Abandoned Application
First Claim
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1. A downhole tool, comprising:

  • a tool body; and

    an electronic module housed in said tool body, which includes a circuit board having a semiconductor device, said semiconductor device including;

    a die;

    a bonding pad which is attached to the surface of said die;

    a bonding wire which is attached to said bonding pad;

    a bonding point which is formed on said bonding pad for connecting said bonding wire to said bonding pad;

    an encapsulating resin partially encapsulating said die and being provided with a cavity such that a connecting portion of said bonding point and said bonding pad is exposed out of said resin in said cavity; and

    a lid on said encapsulating resin to cover said cavity.

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