DOWNHOLE TOOL

• US 20090160047A1
• Filed: 12/21/2007
• Published: 06/25/2009
• Est. Priority Date: 12/21/2007
• Status: Abandoned Application

• Current Assignee: Schlumberger Technology Corporation (SLB)
• Original Assignee: Schlumberger Technology Corporation (SLB)
• Inventors: TAKEDA, JIRO, OTSUKA, AKIRA, MIYAMAE, SHOHACHI
• Application Number:
  US11/963,766
• Publication Number:
  US 20090160047A1
• Time in Patent Office: Days
• US Class Current: 257/704
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A downhole tool having at least one semiconductor device, including: a die; a bonding pad which is attached to the surface of the die; a bonding wire which is attached to the bonding pad; a bonding point which is formed on the bonding pad for connecting the bonding wire to the bonding pad; an encapsulating resin encapsulating the die and being provided with a cavity such that a connecting portion of the bonding point and the bonding pad is exposed out of the resin in the cavity; and a lid on the encapsulating resin to cover the cavity.

Claims

1. A downhole tool, comprising:

a tool body; and

an electronic module housed in said tool body, which includes a circuit board having a semiconductor device, said semiconductor device including;

a die;

a bonding pad which is attached to the surface of said die;

a bonding wire which is attached to said bonding pad;

a bonding point which is formed on said bonding pad for connecting said bonding wire to said bonding pad;

an encapsulating resin partially encapsulating said die and being provided with a cavity such that a connecting portion of said bonding point and said bonding pad is exposed out of said resin in said cavity; and

a lid on said encapsulating resin to cover said cavity.

2. The downhole tool as claimed in claim 1, wherein said lid comprises a ceramic member, a metal member, a plastic member or a glass member.

3. The downhole tool as claimed in claim 1, wherein said lid is attached to said encapsulating resin via an adhesive composed of a thermosetting resin.

4. The downhole tool as claimed in claim 1, wherein said encapsulating resin is composed of a plastic including epoxy resin.

5. The downhole tool as claimed in claim 1, wherein said encapsulating resin is composed of a plastic including epoxy resin and a chemical material that functions as a flame retardant.

6. The downhole tool as claimed in claim 1, wherein said bonding pad is formed of aluminum.

7. The downhole tool as claimed in claim 1, wherein said bonding point connecting said bonding pad and said bonding wire is formed of gold.

8. A semiconductor device, comprising:

a die;

a bonding pad which is attached to the surface of said die;

a bonding wire which is attached to said bonding pad;

a bonding point which is formed on said bonding pad for connecting said bonding wire to said bonding pad;

an encapsulating resin partially encapsulating said die and being provided with a cavity such that a connecting portion of said bonding point and said bonding pad is exposed out of said resin in said cavity; and

a lid on said encapsulating resin to cover said cavity.

9. The semiconductor device as claimed in claim 8, wherein said lid comprises a ceramic member, a metal member, a plastic member or a glass member.

10. The semiconductor device as claimed in claim 8, wherein said lid is attached to said encapsulating resin via an adhesive composed of a thermosetting resin.

11. The semiconductor device as claimed in claim 8, wherein said encapsulating resin is composed of a plastic including epoxy resin.

12. The semiconductor device as claimed in claim 8, wherein said encapsulating resin is composed of a plastic including epoxy resin and a chemical material that functions as a flame retardant.

13. The semiconductor device as claimed in claim 8, wherein said bonding pad is formed of aluminum.

14. The semiconductor device as claimed in claim 8, wherein said bonding point connecting said bonding pad and said bonding wire is formed of gold.

15. A method of manufacturing a semiconductor device, comprising:

forming a cavity at a top side of a plastic encapsulant materials (PEM) semiconductor device,

wherein said semiconductor device including a die;

a bonding pad which is attached to the surface of said die;

a bonding wire which is attached to said bonding pad;

a bonding point which is formed on said bonding pad for connecting said bonding wire to said bonding pad; and

an encapsulating resin that fully encapsulates said die to embed said die therein,

said cavity being formed by removing a part of said encapsulating resin such that a connecting portion of said bonding point and said bonding pad is exposed out of said resin in said cavity; and

attaching a lid on said encapsulating resin to cover said cavity.

16. The method of manufacturing a semiconductor device as claimed in claim 15, wherein said lid is attached on said encapsulating resin via an adhesive.

17. The method of manufacturing a semiconductor device as claimed in claim 15, further comprising before forming the cavity, determining the area for forming said cavity based on the structure of said plastic encapsulant materials (PEM) semiconductor device.