BUSBAR ASSEMBLY WITH INTEGRATED COOLING
First Claim
Patent Images
1. A busbar assembly comprising:
- a plurality of busbars;
a plurality of power semiconductor devices bonded to the plurality of busbars;
wherein at least one of the busbars includes an integrated cooling system.
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Abstract
A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars.
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Citations
20 Claims
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1. A busbar assembly comprising:
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a plurality of busbars; a plurality of power semiconductor devices bonded to the plurality of busbars; wherein at least one of the busbars includes an integrated cooling system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 12, 13, 16)
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10. A vehicular inverter module comprising:
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a plurality of busbars; and a plurality of power semiconductor devices bonded to the plurality of busbars, including pairs of IGBT devices and power diodes connected in an inverter configuration; wherein at least one of the busbars includes an integrated cooling system including one or more channels configured to accept a coolant flowing therethrough. - View Dependent Claims (14, 15)
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17. A method of cooling an inverter module having a plurality of power semiconductor devices mounted therein, the method comprising:
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providing a plurality of busbars having channels formed therein; mounting the power semiconductor devices to the plurality of busbars; coupling a fluid inlet and a fluid outlet to the channels of the plurality of busbars; cycling a cooling fluid through the inlet and the outlet of the plurality of busbars such that heat generated by the power semiconductor devices is transferred thereto. - View Dependent Claims (18, 19, 20)
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Specification