Multi-die Memory, Apparatus and Multi-die Memory Stack
First Claim
Patent Images
1. A multi-die memory, comprising:
- a first die; and
a second die;
wherein the first die comprises a first group of memory banks;
wherein the second die comprises a second group of memory banks;
wherein the first group of memory banks and the second group of memory banks are coupled to a common memory interface configured to couple the multi-die memory with an external connection; and
wherein the first die and the second die and the common memory interface are arranged in a common package.
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Abstract
The multi-die memory comprises a first die and a second die. The first die comprises a first group of memory banks, and the second die comprises a second group of memory banks. The first group of memory banks and the second group of memory banks are coupled to a common memory interface. The common memory interface couples the multi-die memory with an internal connection.
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Citations
23 Claims
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1. A multi-die memory, comprising:
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a first die; and a second die; wherein the first die comprises a first group of memory banks; wherein the second die comprises a second group of memory banks; wherein the first group of memory banks and the second group of memory banks are coupled to a common memory interface configured to couple the multi-die memory with an external connection; and wherein the first die and the second die and the common memory interface are arranged in a common package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An apparatus, comprising:
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first means for carrying a semi-conductor structure; second means for carrying a semi-conductor structure; first means for retaining data, wherein the first means for retaining data comprises a plurality of means for allowing independent activation of rows of means for storing individual data items, and wherein the first means for retaining data is arranged on the first means for carrying a semiconductor structure; second means for retaining data, wherein the second means for retaining data comprises a plurality of means for allowing independent activation of rows of means for storing individual data items, and wherein the second means for retaining data is arranged on the first means for carrying a semi-conductor structure; means for commonly interfacing the first means for retaining data and the second means for retaining data with means for providing an external connection; and means for commonly housing the first means for carrying a semi-conductor structure, the second means for carrying a semi-conductor structure and the means for interfacing.
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20. A multi-die memory stack, comprising:
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a first die; a second die; and a third die; wherein the first die comprises a first group of memory banks; wherein the second die comprises a second group of memory banks; wherein the third die comprises a common memory interface configured to couple the first group of memory banks and the second group of memory banks to a shared external connection; wherein the first group of memory banks is coupled to the common memory interface via a first die-to-die connection; wherein the second group of memory banks is coupled to the common memory interface via a second die-to-die connection; and wherein the common memory interface is configured to selectively drive data received from the shared external connection to the first die-to-die connection or to the second die-to-die connection in dependence on whether the data received from the shared external connection are intended for the first group of memory banks or the second group of memory banks. - View Dependent Claims (21)
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22. A multi-die memory stack, comprising:
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a first die; a second die; and a third die; wherein the first die comprises a first group of memory banks; wherein the second die comprises a second group of memory banks; wherein the third die comprises a common memory interface configured to couple the first group of memory banks and the second group of memory banks to a shared external connection; wherein the first group of memory banks is coupled to the common memory interface via a first die-to-die connection; wherein the second group of memory banks is coupled to the common memory interface via a second die-to-die connection; and wherein the common memory interface is configured to selectively forward data from the first die-to-die connection or from the second die-to-die connection to the shared external connection. - View Dependent Claims (23)
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Specification