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Multi-die Memory, Apparatus and Multi-die Memory Stack

  • US 20090161401A1
  • Filed: 12/24/2007
  • Published: 06/25/2009
  • Est. Priority Date: 12/24/2007
  • Status: Active Grant
First Claim
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1. A multi-die memory, comprising:

  • a first die; and

    a second die;

    wherein the first die comprises a first group of memory banks;

    wherein the second die comprises a second group of memory banks;

    wherein the first group of memory banks and the second group of memory banks are coupled to a common memory interface configured to couple the multi-die memory with an external connection; and

    wherein the first die and the second die and the common memory interface are arranged in a common package.

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