SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND PRODUCTION EQUIPMENT OF THE SAME

• US 20090161712A1
• Filed: 12/11/2008
• Published: 06/25/2009
• Est. Priority Date: 12/20/2007
• Status: Active Grant

• Current Assignee: Godo Kaisha IP Bridge 1 (IP Bridge, Inc.)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Hayami, Isao, Tateyanagi, Masaya
• Granted Patent: US 7,852,900 B2
• Time in Patent Office: Days
• US Class Current: 372/44.10
• CPC Class Codes: G11B 7/123 Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/02208 characterised by the shape of the housings
• CPC Class Codes: H01S 5/02216 Butterfly-type, i.e. with electrode pins extending horizontally from the housings
• CPC Class Codes: H01S 5/32341 blue laser based on GaN or GaP

Abstract

A cap 25 having a piece of glass 26 formed at a laser irradiating position and covering a laser irradiating direction and an upper face of a package 24, is mounted onto the package 24 having lateral faces of a frame body 30 formed in three directions other than the laser irradiating direction, so as to reduce the distance between a semiconductor element 22 and the piece of glass and to reduce a radius 32 of the piece of glass 26. The profile of the semiconductor device can be therefore lowered while maintaining the characteristics of a semiconductor laser. In addition, by mounting the semiconductor device, the profile of an optical pickup device can also be lowered.

Claims

1. A semiconductor device comprising:

a package provided with a mounting face for a semiconductor element;

a frame body of the package formed so that the package opens one face among four peripheral faces bordering the mounting face and an upper face opposing the mounting face;

a plurality of lead terminals fixed to the frame body;

a semiconductor element electrically connected to the lead terminals and mounted on the mounting face;

a cap connected so as to border a face of the frame body in a laser light output direction which is to form a periphery of an aperture portion formed on the upper face of the frame body opposing the mounting face and one face among the four peripheral faces bordering the mounting face, and which seals the semiconductor element inside the package; and

a transparent member placed in a penetrating hole provided on a face of the cap in the laser light output direction and through which laser light can be outputted, wherein

the semiconductor element is mounted so that a laser light output position of the semiconductor element is proximal to the transparent member.

2. The semiconductor device according to claim 1, wherein the semiconductor element is mounted on the mounting face via a submount.

3. The semiconductor device according to claim 1, wherein the semiconductor element is a semiconductor laser element.

4. The semiconductor device according to claim 1, wherein the semiconductor element is a nitride semiconductor laser element.

5. The semiconductor device according to claim 3, wherein a light receiving element is jointly mounted.

6. The semiconductor device according to claim 4, wherein a light receiving element is jointly mounted.

7. The semiconductor device according to claim 3, wherein an optical component is provided in the penetrating hole.

8. The semiconductor device according to claim 4, wherein an optical component is provided in the penetrating hole.

9. The semiconductor device according to claim 3, wherein a boundary portion between an upper side of the frame body opposing the mounting face and a laser light output direction-side of the semiconductor element is formed as a curved surface.

10. The semiconductor device according to claim 4, wherein a boundary portion between an upper side of the frame body opposing the mounting face and a laser light output direction-side of the semiconductor element is formed as a curved surface.

11. The semiconductor device according to claim 3, wherein a portion on a laser light output direction-side of the semiconductor element of the frame body is formed inclined.

12. The semiconductor device according to claim 4, wherein a portion on a laser light output direction-side of the semiconductor element of the frame body is formed inclined.

13. The semiconductor device according to claim 1, wherein a fin is provided on at least one of lateral faces of the package.

14. The semiconductor device according to claim 13, wherein a depression is provided on the fin.

15. A method of manufacturing the semiconductor device according to claim 9, comprising, when connecting the cap to the package, the steps of:

continuously fixing the cap on the upper face of the package up to the aperture face in the laser light output direction by seam welding using a roller electrode; and

fixing the cap onto a base of the aperture face in the laser light output direction and a side of the upper face parallel to the base by seam welding using a roller electrode.

16. Production equipment of a semiconductor device to be used in the method of manufacturing a semiconductor device according to claim 15, the production equipment comprising:

two roller electrodes disposed parallel to each other;

a power supply that applies electrical energy to the roller electrodes;

a mechanism for moving the roller electrodes while applying weight in a horizontal direction;

a mechanism for rotating the semiconductor device by 90 degrees or for sliding the roller electrodes upwards/downwards; and

a mechanism for adjusting movement speed of the roller electrodes.