PHOTOELECTRIC CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF
First Claim
1. A photoelectric conversion device comprising:
- a first unit cell comprising;
a single crystal semiconductor layer;
a first electrode and a first impurity semiconductor layer including one conductivity type, which are provided to a first face side of the single crystal semiconductor layer; and
a second impurity semiconductor layer including a conductivity type opposite to the one conductivity type provided to a second face opposite to the first face;
a second unit cell including a p-type organic semiconductor and an n-type organic semiconductor;
an intermediate layer interposed between the first unit cell and the second unit cell;
an insulating layer on a third face side of the first electrode which is opposite side to the single crystal semiconductor layer; and
a supporting substrate is bonded to the insulating layer,wherein the first unit cell and the second unit cell are connected in series, and wherein the intermediate layer includes a transition metal oxide.
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Abstract
A photoelectric conversion device includes a first unit cell in which one face of a single crystal semiconductor layer is provided with a first electrode and a first impurity semiconductor layer including one conductivity type and an opposite face is provided with a second impurity semiconductor layer including a conductivity type opposite to the one conductivity type, and a second unit cell including a p-type organic semiconductor and an n-type organic semiconductor. The first unit cell and the second unit cell are connected in series with an intermediate layer interposed therebetween. The intermediate layer includes a transition metal oxide. A face of the first electrode which is opposite to the single crystal semiconductor layer is provided with an insulating layer, and the insulating layer is bonded to a supporting substrate.
154 Citations
25 Claims
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1. A photoelectric conversion device comprising:
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a first unit cell comprising; a single crystal semiconductor layer; a first electrode and a first impurity semiconductor layer including one conductivity type, which are provided to a first face side of the single crystal semiconductor layer; and a second impurity semiconductor layer including a conductivity type opposite to the one conductivity type provided to a second face opposite to the first face; a second unit cell including a p-type organic semiconductor and an n-type organic semiconductor; an intermediate layer interposed between the first unit cell and the second unit cell; an insulating layer on a third face side of the first electrode which is opposite side to the single crystal semiconductor layer; and a supporting substrate is bonded to the insulating layer, wherein the first unit cell and the second unit cell are connected in series, and wherein the intermediate layer includes a transition metal oxide. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a photoelectric conversion device, comprising the steps of:
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introducing a cluster ion to a single crystal semiconductor substrate through a first face thereof at a depth of 10 μ
m or less from the first face to form a damaged layer;forming a first impurity semiconductor layer on the first face side; forming a first electrode on the first face side; forming an insulating layer on the first face side; bonding a supporting substrate to the insulating layer; cleaving the single crystal semiconductor substrate along the damaged layer to make a single crystal semiconductor layer remain over the supporting substrate; forming a second impurity semiconductor layer on a cleavage plane side of the single crystal semiconductor layer; forming an intermediate layer over the second impurity semiconductor layer; forming a second unit cell including a p-type organic semiconductor and an n-type organic semiconductor over the intermediate layer; and forming a second electrode over the second unit cell. - View Dependent Claims (14, 16, 18, 20, 22, 24)
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13. A method of manufacturing a photoelectric conversion device, comprising the steps of:
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introducing an ion beam to a single crystal semiconductor substrate through a first face thereof, to form a damaged layer at a predetermined depth from the first face; forming at least a first impurity semiconductor layer including one conductivity type, a first electrode in contact with the first impurity semiconductor layer, and an insulating layer over the first electrode, on the surface side of the single crystal semiconductor substrate to which the cluster ion is introduced; disposing the single crystal semiconductor substrate so that a face of a supporting substrate is in contact with the insulating layer; forming a crack in the damaged layer by a thermal treatment, and separating and removing the single crystal semiconductor substrate while a single crystal semiconductor layer remains over the supporting substrate; forming a second impurity semiconductor layer including a conductivity type opposite to the one conductivity type on a surface side of the single crystal semiconductor layer exposed by separation; forming an intermediate layer over the second impurity semiconductor layer; forming a second unit cell including a p-type organic semiconductor and an n-type organic semiconductor over the intermediate layer; and forming a second electrode over the second unit cell, wherein the ion beam comprises a cluster ion, which has heavier mass than a hydrogen molecule, at 50% or more with respect to the total ions of the ion beam. - View Dependent Claims (15, 17, 19, 21, 23, 25)
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Specification