LIGHT-EMITTING DEVICE WITH INORGANIC HOUSING

• US 20090166651A1
• Filed: 11/15/2005
• Published: 07/02/2009
• Est. Priority Date: 11/19/2004
• Status: Active Grant

• Current Assignee: Signify Holding B.V. (Signify N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Beckers, Lucas Johannes Anna Maria
• Granted Patent: US 7,714,335 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 25/075 the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10K 2102/3026 Top emission
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/856 comprising reflective means

Abstract

The present invention relates to a light-emitting device comprising at least one light-emitting diode, which emits light, and a housing arranged to receive at least a portion of said light. The housing comprises a translucent inorganic material and is provided with at least one recess, which comprises positioning and orientating means. The at least one light-emitting diode is arranged in the at least one recess and is positioned and orientated by said positioning and orientating means, and a translucent inorganic contact layer material is arranged between the at least one light-emitting diode and the housing in the at least one recess to receive at least portion of the light and to connect said light-emitting diode to said housing.

Claims

1. A light-emitting device comprising at least one light-emitting diode (2), which in operation emits light, and a housing (4) arranged to receive at least a portion of said light, characterized in that

said housing comprises a translucent inorganic material and is provided with at least one recess (7) comprising positioning and orientating means,

said least one light-emitting diode is arranged in said at least one recess and being positioned and orientated by said positioning and orientating means, and

a translucent inorganic contact layer material (5) is arranged between said at least one light-emitting diode and said housing in said at least one recess to receive at least portion of said light and to connect said at least one light-emitting diode to said housing.

2. A light-emitting device according to claim 1, wherein the at least one recess (7) comprises walls which constitute said positioning and orientating means.

3. A light-emitting device according to claim 1, further comprising a substrate (1) on which a circuitry (8) is arranged, and wherein said at least one light-emitting diode (2) is arranged on and connected to said circuitry.

4. A light-emitting device according to claim 3, comprising an array of a plurality of light-emitting diodes, wherein a first light-emitting diode is positioned in a first location and orientated in a first orientation and a second light-emitting diode is positioned in a second position and orientated in a second orientation, wherein said circuitry is arranged on and connected to said first light-emitting diode at said first location and arranged on and connected to said second light-emitting diode at said second location.

5. A light-emitting device according to claim 4, wherein said first light emitting diode is arranged in a first recess and said second light emitting diode is arranged in a second recess.

6. A light-emitting device according to claim 1, wherein said translucent inorganic material comprised in said housing comprises a ceramic material selected from the group consisting of polycrystalline alumina (Al₂O₃), yttrium-aluminum-garnet (YAG, Y₃Al₅O₁₂), yttria (Y₂O₃), (MgAl₂O₄), MgAlON, AlON, AlMgSi-oxide, SiON, SiAlON and titania (TiO₂) doped zirconia (ZrO₂) and mixtures thereof.

7. A light-emitting device according to claim 1, wherein said translucent inorganic material comprised in the housing comprises a phosphor compound comprising yttrium-aluminum-garnet (YAG) doped with an element selected from the group consisting of cerium, praseodymium, europium and combinations thereof.

8. A light-emitting device according to claim 1, wherein said contact layer material comprises a glass material selected from the group consisting of chalcogenide glass, lead silicate, tellurate glass, bismuth glass and combinations thereof.

9. A light-emitting device according to claim 1, wherein said contact layer material comprises a luminescent material.

10. A light-emitting device according to claim 4, wherein a first contact layer material is arranged between said first light-emitting diode and said housing and a second contact layer material is arranged between said second light-emitting diode and said housing, and wherein at least one of said first and second contact layer materials comprise a luminescent material.

11. A method for the manufacture of a light-emitting device, comprising:

providing at least one light-emitting diode;

providing a housing having at least one recess, said housing comprising a translucent inorganic material;

arranging positioning and orientating means in said at least one recess;

arranging a translucent inorganic contact layer material in said recess; and

arranging said at least one light-emitting diode on said contact layer material in said recess, such that said light emitting diode is positioned and orientated by said orientating and positioning means, and said contact layer and said housing receives at least part of light emitted by said light-emitting diode.

12. A method according to claim 11, further comprising connecting said at least one light-emitting diode to a circuitry.

13. A method according to claim 11, wherein said contact material is arranged in said recess at temperature above the softening temperature for said contact material.

14. A method according to claim 13, wherein said temperature above the softening temperature for said contact material is in the range of from 300°

C. to 1600°

C.

15. A method according to claim 11, wherein said light-emitting diode is arranged in said recess at a temperature between the glass temperature and the softening temperature of said contact material.

16. A method according to claim 15, wherein said temperature between the glass temperature and the softening temperature is from 300°

C. to 400°

C.