LIGHT EMITTING DEVICE

• US 20090166657A1
• Filed: 12/22/2008
• Published: 07/02/2009
• Est. Priority Date: 12/28/2007
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: YAMADA, Motokazu, IZUNO, Kunihiro, INOBE, Mototaka
• Granted Patent: US 8,049,237 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/4945 Wire connectors having connecting portions of different types on the semiconductor or solid-state body, e.g. regular and reverse stitches
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a substrate provided with a conductor wiring, a light emitting element mounted on the substrate and a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element. The light emitting device also includes at least one of an electrically conductive wire electrically connecting the conductor wiring and the light emitting element, an exposed region of the substrate on which the conductor wiring is not disposed, and a protective element mounted on the conductor wiring. At least a part of the electrically conductive wire, the exposed region or the protective element is buried in the light reflecting resin member.

Claims

1. A light emitting device comprising:

a substrate provided with a conductor wiring;

a light emitting element mounted on the conductor wiring;

a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element; and

an electrically conductive wire electrically connecting the conductor wiring and the light emitting element with at least a part of the electrically conductive wire being buried in the light reflecting resin member.

2. The light emitting device according to claim 1, wherein

the substrate has an exposed region on which the conductor wiring is not disposed, and at least a part of the exposed region is buried in the light reflecting resin member.

3. The light emitting device according to claim 1, further comprising

a protective element electrically connected with the conductor wiring with at least a part of the protective element being buried in the light reflecting resin member.

4. The light emitting device according to claim 1, wherein

the light reflecting resin member has a first region spaced apart from an outer edge of the substrate and a second region being in contact with an outer edge of the substrate.

5. The light emitting device according to claim 4, wherein

the light reflecting resin member includes an additional second region being in contact with an outer edge of the substrate, the first region being interposed between the second region and the additional second region at a side of the substrate.

6. The light emitting device according to claim 4, wherein

the second region of the light reflecting resin member is spaced apart from a corner of the substrate.

7. The light emitting device according to claim 1, wherein

at least a part of the light emitting element is in contact with the light reflecting resin member.

8. A light emitting device comprising:

a substrate provided with a conductor wiring with the substrate having an exposed region on which the conductor wiring is not disposed;

a light emitting element mounted on the conductor wiring; and

a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element,

at least a part of the exposed region of the substrate being buried in the light reflecting resin member.

9. The light emitting device according to claim 8, wherein

the light reflecting resin member has a first region spaced apart from an outer edge of the substrate and a second region being in contact with an outer edge of the substrate.

10. The light emitting device according to claim 9, wherein

the light reflecting resin member includes an additional second region being in contact with an outer edge of the substrate, the first region being interposed between the second region and the additional second region at a side of the substrate.

11. The light emitting device according to claim 9, wherein

the second region of the light reflecting resin member is spaced apart from a corner of the substrate.

12. The light emitting device according to claim 8, wherein

at least a part of the light emitting element is in contact with the light reflecting resin member.

13. A light emitting device comprising:

a substrate provided with a conductor wiring;

a light emitting element mounted on the conductor wiring;

a protective element mounted on the conductor wiring; and

a light reflecting resin member configured and arranged to reflect light emitted from the light emitting element,

at least a part of the protective element being buried in the light reflecting resin member.

14. The light emitting device according to claim 13, wherein

the substrate has an exposed region on which the conductor wiring is not disposed, and at least a part of the exposed region is buried in the light reflecting resin member.

15. The light emitting device according to claim 13, wherein

the light reflecting resin member has a first region spaced apart from an outer edge of the substrate and a second region being in contact with an outer edge of the substrate.

16. The light emitting device according to claim 15, wherein

the light reflecting resin member includes an additional second region being in contact with an outer edge of the substrate, the first region being interposed between the second region and the additional second region at a side of the substrate.

17. The light emitting device according to claim 15, wherein

the second region of the light reflecting resin member is spaced apart from a corner of the substrate.

18. The light emitting device according to claim 13, wherein

at least a part of the light emitting element is in contact with the light reflecting resin member.