SEMICONDUCTOR DEVICE, METHOD FOR OPERATING A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
First Claim
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1. A semiconductor device, comprising:
- a semiconductor substrate;
at least a pn-junction arranged in the semiconductor substrate;
at least a field electrode arranged at least next to a portion of the pn-junction, the field electrode being insulated from the semiconductor substrate; and
a switching device being electrically connected to the field electrode and adapted to apply selectively and dynamically one of a first electrical potential and a second electrical potential, which is different to the first electrical potential, to the field electrode to alter the avalanche breakdown characteristics of the pn-junction.
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Abstract
A semiconductor device includes a semiconductor substrate having at least a pn-junction arranged in the semiconductor substrate. At least a field electrode is arranged at least next to a portion of the pn-junction, wherein the field electrode is insulated from the semiconductor substrate. A switching device is electrically connected to the field electrode and adapted to apply selectively and dynamically one of a first electrical potential and a second electrical potential, which is different to the first electrical potential, to the field electrode to alter the avalanche breakdown characteristics of the pn-junction.
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Citations
25 Claims
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1. A semiconductor device, comprising:
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a semiconductor substrate; at least a pn-junction arranged in the semiconductor substrate; at least a field electrode arranged at least next to a portion of the pn-junction, the field electrode being insulated from the semiconductor substrate; and a switching device being electrically connected to the field electrode and adapted to apply selectively and dynamically one of a first electrical potential and a second electrical potential, which is different to the first electrical potential, to the field electrode to alter the avalanche breakdown characteristics of the pn-junction. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor device, comprising:
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a semiconductor substrate comprising a first surface and a second surface arranged opposite to the first surface; a first doping region formed in the semiconductor substrate at the first surface; a second doping region formed in the semiconductor substrate at the second surface; at least a first trench formed in the semiconductor substrate and extending from the first surface into the semiconductor substrate, the first trench comprising a gate electrode and a field electrode; at least a second trench formed in the semiconductor substrate and extending from the first surface into the semiconductor substrate, the second trench being laterally spaced to the first trench and comprising at least a field electrode; and a switching device being electrically connected to the field electrode of the second trench and adapted to apply selectively and dynamically one of a first electrical potential, which substantially corresponds to the electrical potential of the first doping region, and a second electrical potential, which substantially corresponds to the electrical potential of the second doping region, to the field electrode of the second electrode. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A semiconductor device, comprising:
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a semiconductor substrate comprising a first surface and a second surface arranged opposite to the first surface; a first doping region formed in the semiconductor substrate at the first surface; a second doping region formed in the semiconductor substrate at the second surface; at least a first trench formed in the semiconductor substrate and extending from the first surface into the semiconductor substrate, the first trench comprising at least a gate electrode; at least a second trench formed in the semiconductor substrate and extending from the first surface into the semiconductor substrate, the second trench being laterally spaced to the first trench and comprising at least a field electrode; a contact pad in electrical connection with the first doping region; and a control contact pad in electrical connection with the field electrode of the second trench. - View Dependent Claims (17)
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18. A method for operating a semiconductor device, comprising:
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providing a semiconductor device which comprises a semiconductor substrate comprising at least a pn-junction arranged in the semiconductor substrate, at least a field electrode arranged at least next to a portion of the pn-junction, the field electrode being insulated from the semiconductor substrate; operating the pn-j unction at least temporarily in reverse mode; applying a first electrical potential to the field electrode; and temporarily disconnecting the field electrode from the first electrical potential and applying a second electrical potential to the field electrode so that the avalanche breakdown characteristics of the pn-junction are altered. - View Dependent Claims (19, 20)
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21. A method for manufacturing a semiconductor device, comprising:
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providing a semiconductor substrate; forming at least a pn-junction in the semiconductor substrate; forming at least a field electrode arranged at least next to a portion of the pn-junction, the field electrode being insulated from the semiconductor substrate; and forming a switching device in electrical connection to the field electrode. - View Dependent Claims (22, 23, 24, 25)
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Specification