MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER

• US 20090166834A1
• Filed: 12/27/2007
• Published: 07/02/2009
• Est. Priority Date: 12/27/2007
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Bae, JoHyun, Shin, HanGil, Yoon, In Sang
• Granted Patent: US 7,800,212 B2
• Time in Patent Office: Days
• US Class Current: 257/686
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06568 the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 2225/1088 Arrangements to limit the height of the assembly
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/03 all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

A mountable integrated circuit package system includes: forming a base integrated circuit package system includes: providing a first substrate, and forming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity.

Claims

1. A mountable integrated circuit package system comprising:

forming a base integrated circuit package system includes;

providing a first substrate, and

forming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and

mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity.

2. The system as claimed in claim 1 further comprising mounting a first integrated circuit device over the first substrate within the central aperture.

3. The system as claimed in claim 1 further comprising providing an electrical connector between the interposer and the first substrate.

4. The system as claimed in claim 1 further comprising mounting a mounting integrated circuit device over the interposer.

5. The system as claimed in claim 1 further comprising mounting a first integrated circuit device having a first encapsulation.

6. A mountable integrated circuit package system comprising:

forming a base integrated circuit package system includes;

providing a carrier having an inner integrated circuit device thereover,

mounting a first substrate over the inner integrated circuit device, and

forming a package encapsulation having a cavity over the first substrate, the inner integrated circuit device, and the carrier with the first substrate partially exposed within the cavity; and

mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity.

7. The system as claimed in claim 6 wherein mounting the interposer includes:

mounting the interposer having a bottom interposer side with electrical contacts; and

connecting an electrical connector between one of the electrical contacts and the first substrate.

8. The system as claimed in claim 6 wherein forming the package encapsulation includes:

connecting a first internal interconnect between the first substrate and the carrier; and

forming the package encapsulation over the carrier, the inner integrated circuit device, the first internal interconnect, and partially exposing the first substrate within the cavity.

9. The system as claimed in claim 6 further comprising:

mounting a mounting integrated circuit device over the interposer; and

connecting an electrical connector between the mounting integrated circuit device and the interposer.

10. The system as claimed in claim 6 further comprising mounting a passive device over the first substrate within the cavity.

11. A mountable integrated circuit package system comprising:

a base integrated circuit package system including;

a first substrate; and

a package encapsulation having a cavity formed over the first substrate with the first substrate partially exposed within the cavity; and

an interposer including a central aperture mounted over the package encapsulation and the first substrate with the central aperture over the cavity.

12. The system as claimed in claim 11 further comprising a first integrated circuit device mounted over the first substrate within the central aperture.

13. The system as claimed in claim 11 further comprising an electrical connector connected between the interposer and the first substrate.

14. The system as claimed in claim 11 further comprising a mounting integrated circuit device mounted over the interposer.

15. The system as claimed in claim 11 further comprising a first integrated circuit device having a first encapsulation.

16. The system as claimed in claim 11 wherein the base integrated circuit package system includes:

a carrier having an inner integrated circuit device mounted thereover;

the first substrate mounted over the inner integrated circuit device; and

the package encapsulation formed over the first substrate, the inner integrated circuit device, and the carrier.

17. The system as claimed in claim 16 wherein:

the interposer includes a bottom interposer side with a first electrical contact and a top interposer side with a second electrical contact; and

further comprising;

an electrical connector connected between the second electrical contact and the first substrate.

18. The system as claimed in claim 16 further comprising:

a first internal interconnect connected between the first substrate and the carrier; and

wherein the package encapsulation is over the carrier, the inner integrated circuit device, the first internal interconnect, and partially exposing the first substrate within the cavity.

19. The system as claimed in claim 16 further comprising:

a mounting integrated circuit device mounted over the interposer; and

an electrical connector connected between the mounting integrated circuit device and the interposer.

20. The system as claimed in claim 16 further comprising a passive device mounted over the first substrate within the cavity.