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MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER

  • US 20090166834A1
  • Filed: 12/27/2007
  • Published: 07/02/2009
  • Est. Priority Date: 12/27/2007
  • Status: Active Grant
First Claim
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1. A mountable integrated circuit package system comprising:

  • forming a base integrated circuit package system includes;

    providing a first substrate, andforming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and

    mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity.

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