MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSULATION

• US 20090166886A1
• Filed: 12/27/2007
• Published: 07/02/2009
• Est. Priority Date: 12/27/2007
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Park, Soo-San, Kim, YoungJoon
• Granted Patent: US 8,247,893 B2
• Time in Patent Office: Days
• US Class Current: 257/777
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18161 : of a flip chip
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A mountable integrated circuit package system comprising: mounting a first integrated circuit device over a package carrier; mounting an interposer including a central aperture over the package carrier, an intra-stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and forming an intra-stack encapsulation over the package carrier and surrounding the interposer.

Claims

1. A mountable integrated circuit package system comprising:

mounting a first integrated circuit device over a package carrier;

mounting an interposer including a central aperture over the package carrier, an intra-stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and

forming an intra-stack encapsulation over the package carrier and surrounding the interposer.

2. The system as claimed in claim 1 further comprising mounting a top integrated circuit device over the interposer.

3. The system as claimed in claim 1 wherein forming the intra-stack encapsulation includes exposing a top interposer side of the interposer.

4. The system as claimed in claim 1 wherein forming the intra-stack encapsulation includes exposing a top device side of the first integrated circuit device.

5. The system as claimed in claim 1 further comprising mounting a passive device over a top interposer side of the interposer.

6. A mountable integrated circuit package system comprising:

mounting a first integrated circuit device over a package carrier;

mounting an interposer including a central aperture over the package carrier, an intra-stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and

forming an intra-stack encapsulation over the package carrier, surrounding the interposer and the first integrated circuit device, with a top interposer side of the interposer exposed.

7. The system as claimed in claim 6 further comprising applying an underfill between the first integrated circuit device and the package carrier.

8. The system as claimed in claim 6 further comprising connecting a first internal interconnect between the first integrated circuit device and the package carrier.

9. The system as claimed in claim 6 wherein forming the intra-stack encapsulation includes forming the intra-stack encapsulation between the first integrated circuit device and the package carrier.

10. The system as claimed in claim 6 wherein forming the intra-stack encapsulation includes forming the intra-stack encapsulation between the interposer and the package carrier.

11. A mountable integrated circuit package system comprising:

a first integrated circuit device mounted over a package carrier;

an interposer including a central aperture mounted over the package carrier, an intra- stack interconnect connected between the interposer and the package carrier, and the first integrated circuit device within the central aperture; and

an intra-stack encapsulation formed over the package carrier and surrounding the interposer.

12. The system as claimed in claim 11 further comprising a top integrated circuit device mounted over the interposer.

13. The system as claimed in claim 11 wherein the intra-stack encapsulation exposes a top interposer side of the interposer.

14. The system as claimed in claim 11 wherein the intra-stack encapsulation exposes a top device side of the first integrated circuit device.

15. The system as claimed in claim 11 further comprising a passive device mounted over a top interposer side of the interposer.

16. The system as claimed in claim 11 wherein the intra-stack encapsulation surrounds the first integrated circuit device with a top interposer side of the interposer exposed.

17. The system as claimed in claim 16 further comprising an underfill formed between the first integrated circuit device and the package carrier.

18. The system as claimed in claim 16 further comprising a first internal interconnect between the first integrated circuit device and the package carrier.

19. The system as claimed in claim 16 wherein the intra-stack encapsulation includes the intra-stack encapsulation formed between the first integrated circuit device and the package carrier.

20. The system as claimed in claim 16 wherein the intra-stack encapsulation includes the intra-stack encapsulation formed between the interposer and the package carrier.