CIRCUIT SUBSTRATE, CIRCUIT DEVICE AND MANUFACTURING PROCESS THEREOF
First Claim
1. A circuit substrate comprising:
- a metal substrate comprising a top surface, a bottom surface, a first side surface and a second side surface;
an insulating layer covering the top surface of the metal substrate; and
a conductive pattern formed on the insulating layer,wherein the first side surface comprises a first inclining side surface inclining from the top surface and a second inclining side surface inclining from the bottom surface, and the first inclining side surface is shorter in a corresponding inclining direction thereof than the second inclining side surface in a corresponding inclining direction thereof.
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Accused Products
Abstract
A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern. The top surface is insulated. Each of the side surfaces of the metal substrate includes a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate, and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces.
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Citations
21 Claims
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1. A circuit substrate comprising:
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a metal substrate comprising a top surface, a bottom surface, a first side surface and a second side surface; an insulating layer covering the top surface of the metal substrate; and a conductive pattern formed on the insulating layer, wherein the first side surface comprises a first inclining side surface inclining from the top surface and a second inclining side surface inclining from the bottom surface, and the first inclining side surface is shorter in a corresponding inclining direction thereof than the second inclining side surface in a corresponding inclining direction thereof. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A circuit substrate comprising:
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a metal substrate comprising a top surface, a bottom surface, a first side surface and a second side surface; an insulating layer covering the top surface of the metal substrate; and a conductive pattern formed on the insulating layer, wherein the first side surface comprises a first inclining side surface inclining from the top surface, the second side surface comprises a second inclining side surface inclining from the top surface, and the first inclining side surface is shorter in a corresponding inclining direction thereof than the second inclining side surface in a corresponding inclining direction thereof. - View Dependent Claims (8, 9, 10, 11)
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12. A circuit substrate comprising:
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a metal substrate comprising a top surface, a bottom surface, a first side surface, a second side surface opposite from the first side surface, a third side surface and a fourth side surface opposite from the third side surface; an insulating layer covering the top surface of the metal substrate; and a conductive pattern formed on the insulating layer, wherein the first side surface comprises a first inclining side surface inclining from the top surface, the second side surface comprises a second inclining side surface inclining from the top surface, the third side surface comprises a third inclining side surface inclining from the top surface, the fourth side surface comprises a fourth inclining side surface inclining from the top surface, and the first and second inclining side surfaces are shorter in corresponding inclining directions thereof than the third and fourth inclining side surfaces in corresponding inclining directions thereof. - View Dependent Claims (13)
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14. A method of manufacturing a circuit substrate, comprising:
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providing a conductive pattern corresponding to a plurality of circuit units on a top surface of a substrate; forming, in the top surface of the substrate, first grooves and second grooves that cross the first grooves and are shallower than the first groves so that the first and second grooves define regions of the circuit units; forming, in a bottom surface of the substrate, third grooves and fourth grooves that cross the third grooves and are deeper than the third groves so that the third grooves correspond to the first grooves and the fourth grooves correspond to the second grooves; and separating the circuit units from each other at the grooves. - View Dependent Claims (15, 16, 17)
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18. A semiconductor device comprising:
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a metal substrate comprising a top surface, a bottom surface and four side surfaces, the top surface being insulated; a conductive pattern insulated from the metal substrate; and a semiconductor element mounted on and electrically connected to the conductive pattern, wherein each of the side surfaces of the metal substrate comprises a first inclining side surface and a second inclining side surface so as to form a convex shape protruding outwardly between the top surface and the bottom surface of the metal substrate; and the first inclining side surfaces of a pair of two opposing side surfaces are smaller than corresponding first inclining side surfaces of another pair of two opposing side surfaces. - View Dependent Claims (19, 20, 21)
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Specification