LIGHT SOURCE MODULE WITH HIGH HEAT-DISSIPATION EFFICIENCY

• US 20090167134A1
• Filed: 11/21/2008
• Published: 07/02/2009
• Est. Priority Date: 12/28/2007
• Status: Abandoned Application

• Current Assignee: Foxsemicon Integrated Technology Incorporated
• Original Assignee: Foxsemicon Integrated Technology Incorporated
• Inventors: TSAO, CHIH-CHUNG, JIANG, WEN-JANG
• Application Number:
  US12/275,339
• Publication Number:
  US 20090167134A1
• Time in Patent Office: Days
• US Class Current: 313/46
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 33/645 the elements being electrically controlled, e.g. Peltier elements
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

An exemplary embodiment of a light source module includes a thermoelectric cooler, many LED chips, and a circuit layer. The thermoelectric cooler includes a first heat-conducting dielectric plate, a second heat-conducting dielectric plate opposite to the first heat-conducting dielectric plate, and a number of thermoelectric elements located between the first heat-conducting dielectric plate and the second heat-conducting dielectric plate. The thermoelectric elements are connected with each other. The LED chips and the circuit layer are formed on the first heat-conducting dielectric plate and facing away from the second heat-conducting dielectric plate, and the LED chips are electrically connected to the circuit layer.

Claims

1. A light source module, comprising:

a thermoelectric cooler including a first heat-conducting dielectric plate, a second heat-conducting dielectric plate opposite to the first heat-conducting dielectric plate, and a plurality of thermoelectric elements located between the first heat-conducting dielectric plate and the second heat-conducting dielectric plate, the thermoelectric elements connected with each other;

a plurality of LED chips; and

a circuit layer, the circuit layer and the LED chips being formed on the first heat-conducting dielectric plate and facing away from the second heat-conducting dielectric plate, and the LED chips being electrically connected to the circuit layer.

2. The light source module of claim 1, wherein the LED chips are directly mounted on the first heat-conducting insulated plate.

3. The light source module of claim 1, wherein the LED chips are flip-chips bonded on the first heat-conducting dielectric plate.

4. The light source module of claim 1, wherein the LED chips are electrically connected to the circuit layer by metal wires.

5. The light source module of claim 1, further comprising a plurality of heat-dissipating fins being located on the second heat-conducting dielectric plate and extending in a direction away from the first heat-conducting dielectric plate.

6. The light source module of claim 1, wherein the first and second heat-conducting dielectric plate are made of ceramic, silicon, or anodic aluminum oxide material.

7. The light source module of claim 1, wherein the thermoelectric elements each includes a conductive substrate, a P-type semiconductor, and an N-type semiconductor, the P-type and N-type semiconductors are parallel to each other and electrically connected to the conductive substrate, each two adjacent thermoelectric elements are electrically connected with each other.

8. A light source module, comprising:

a thermoelectric cooler including

a first heat-conducting dielectric plate at a cold side thereof,

a second heat-conducting dielectric plate at a hot side, opposite to the first heat-conducting dielectric plate, and

a plurality of thermoelectric elements located between the first heat-conducting dielectric plate and the second heat-conducting dielectric plate;

a plurality of LED chips formed on and brought into contact with the first heat-conducting dielectric plate; and

a circuit layer form on and brought into contact with the first heat-conducting dielectric plate, and the LED chips being electrically connected to the circuit layer.

9. The light source module of claim 8, wherein the first heat-conducting dielectric plate is comprised of a material selected from the group consisting of ceramic, silicon, anodic aluminum oxide, and glass fiber.