Packaged Integrated Circuits Having Inductors and Methods to Form Inductors in Packaged Integrated Circuits

• US 20090168387A1
• Filed: 12/31/2007
• Published: 07/02/2009
• Est. Priority Date: 12/31/2007
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Evans, David W., Hung, Chih-Ming, Leipold, Dirk
• Granted Patent: US 8,389,868 B2
• Time in Patent Office: Days
• US Class Current: 361/811
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/4911 the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2224/92247 : the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

Claims

1. A method of forming an inductor in a packaged integrated circuit, comprising:

forming a substrate having a first trace and a contact;

attaching an integrated circuit to the substrate over the first trace; and

electrically coupling the first trace to the a contact on the substrate via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.

2. A method as defined in claim 1, further comprising electrically coupling the integrated circuit to the first trace via a second electrical conductor.

3. A method as defined in claim 1, wherein the contact is a second trace, the integrated circuit being attached to the substrate over the second trace.

4. A method as defined in claim 1, wherein the electrical conductor comprises one or more bond wires.

5. A method as defined in claim 1, wherein electrically coupling the first trace to the contact comprises placing one or more bond wires from a first side of the integrated circuit to a second side of the integrated circuit.

6. A method as defined in claim 1, wherein electrically coupling the first trace to the contact via the electrical conductor comprises:

coupling the electrical conductor to the first trace;

coupling the electrical conductor to one or more contacts on the integrated circuit; and

coupling the electrical conductor to the contact.

7. A method as defined in claim 1, wherein electrically coupling the first trace to the contact via the electrical conductor comprises:

coupling a second trace to the first trace via a first bond wire, wherein the second trace is disposed over the integrated circuit; and

coupling the second trace to the contact via a second bond wire.

8. A method as defined in claim 1, further comprising forming a via in the substrate to electrically couple the contact to a conductive element on a surface of the packaged integrated circuit.

9. A packaged integrated circuit having an inductor, comprising:

a substrate having a first trace and a contact;

an integrated circuit attached to the substrate over the trace; and

an electrical conductor to electrically couple the first trace to the contact on the substrate and extend over the integrated circuit to form the inductor in the packaged integrated circuit.

10. A packaged integrated circuit as defined in claim 9, wherein the contact is a second trace, the integrated circuit being attached to the substrate over the second trace.

11. A packaged integrated circuit as defined in claim 9, wherein the electrical conductor comprises one or more bond wires.

12. A packaged integrated circuit as defined in claim 11, wherein the one or more bond wires are coupled to one or more contacts on the integrated circuit.

13. A packaged integrated circuit as defined in claim 9, wherein the electrical conductor comprises:

a second trace disposed over the integrated circuit;

a first bond wire to electrically couple the first trace to the second trace; and

a second bond wire to electrically couple the second trace to the contact.

14. A packaged integrated circuit as defined in claim 9, further comprising a second electrical conductor to electrically couple the integrated circuit to the first trace.

15. A packaged integrated circuit as defined in claim 14, further comprising a third electrical conductor to electrically couple the integrated circuit to the contact.

16. A packaged integrated circuit as defined in claim 14, further comprising a via to electrically couple the contact to a conductive element on a surface of the packaged integrated circuit.

17. An electronic device, comprising:

a circuit board; and

a packaged integrated circuit attached to the circuit board, the packaged integrated circuit having a substrate having a first trace and a contact, an integrated circuit attached to the substrate over the trace, and an electrical conductor to electrically couple the first trace to the contact, wherein the electrical conductor is to extend over the integrated circuit to form an inductor in the packaged integrated circuit.

18. An electronic device as defined in claim 17, wherein the contact is a second trace, the integrated circuit being attached to the substrate over the second trace.

19. An electronic device as defined in claim 17, wherein the electrical conductor comprises one or more bond wires.

20. An electronic device as defined in claim 19, wherein the one or more bond wires are coupled to one or more contacts on the integrated circuit.

21-24. -24. (canceled)