Light emitting diode unit

• US 20090168449A1
• Filed: 06/11/2008
• Published: 07/02/2009
• Est. Priority Date: 12/27/2007
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Ho-Joon, Lee, Hwa-Young, Yoon, Sang-Jun, Kim, Jin-Cheol, Oh, Jun-Rok
• Application Number:
  US12/155,931
• Publication Number:
  US 20090168449A1
• Time in Patent Office: Days
• US Class Current: 362/555
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/86 Ceramics or glass
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0251 Non-conductive microfibers
• CPC Class Codes: H05K 2201/029 Woven fibrous reinforcement or textile
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

Disclosed is a light emitting diode unit, more particularly, a light emitting diode unit including a thermoplastic substrate, a light emitting diode, mounted on one surface of the thermoplastic substrate and a heat sink, directly adhered to the other surface of the thermoplastic substrate. With the present invention, the manufacturing cost and the manufacturing time of the light emitting diode unit can be reduced by allowing the heat sink, discharging the heat generated by the light emitting diode, to be directly adhered to the substrate on which the light emitting diode is mounted. Also, the heat discharging ability of the light emitting diode unit by using the heat sink directly adhered to the thermoplastic substrate.

Claims

1. A light emitting diode unit comprising:

a thermoplastic substrate;

a light emitting diode, mounted on one surface of the thermoplastic substrate; and

a heat sink, directly adhered to the other surface of the thermoplastic substrate.

2. The light emitting diode unit of claim 1, wherein the thermoplastic substrate is made based on one of a liquid crystal polymer, a Polyetherimide (PEI), a Polyethersulfone (PES), a Polyetheretherketone (PEEK) and a Polytetrafluoroethylene (PTFE) or a combination thereof.

3. The light emitting diode unit of claim 2, wherein the heat sink is made of a metal.

4. The light emitting diode unit of claim 2, wherein the thermoplastic substrate comprises scattered ceramic filters.

5. The light emitting diode unit of claim 2, wherein the thermoplastic substrate comprises scattered glass fibers.

6. The light emitting diode unit of claim 2, wherein the thermoplastic substrate comprises a glass fiber cloth formed by a weave of a weft and a warp including a plurality of glass fiber twists.