ORGANIC ELECTROLUMINESCENCE DEVICE

• US 20090170393A1
• Filed: 03/03/2009
• Published: 07/02/2009
• Est. Priority Date: 05/07/2004
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Kanai, Masahiro, Mitsui, Mutsuo, Koike, Atsushi
• Granted Patent: US 8,298,031 B2
• Time in Patent Office: Days
• US Class Current: 445/25
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/8423 Metallic sealing arrangements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: H10K 59/871 Self-supporting sealing arrangements
• CPC Class Codes: H10K 59/8721 Metallic sealing arrangements
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/874 including getter material or desiccant

Abstract

The present invention provides an excellent organic EL device with a glass substrate and a sealing glass sheet which are thinned for weight reduction while avoiding lowering the durability and impact resistance of the device. The organic luminescence device is characterized in that sealing is performed at the space between a face of the sealing glass sheet along the outer edge and a face of the device substrate with a low melting point metal.

Claims

1. A process for producing an organic electroluminescence device, comprising the steps of:

forming an organic luminescence element portion on a substrate; and

sealing the organic luminescence element portion with a sealing glass sheet,

wherein the sealing step is conducted under a reduced pressure atmosphere and comprises the steps of;

bringing the substrate and the sealing glass sheet into direct contact with each other at a periphery of the sealing glass sheet; and

fixing the sealing glass sheet to the substrate with a low melting point metal applied along an outer edge of the sealing glass sheet and an adjoining surface of the substrate.

2. The process according to claim 1, wherein the sealing glass sheet has a thickness of 0.1 to 0.5 mm, and the reduced pressure atmosphere of the sealing step is 1/10 atm to 1/100 atm.

3. The process according to claim 1, wherein the sealing step further comprises the step of providing a passivation layer containing at least silicon between the substrate and the sealing glass sheet.