WHITE LIGHT EMITTING DEVICE
1 Assignment
0 Petitions
Accused Products
Abstract
The invention relates to a monolithic white light emitting device using wafer bonding or metal bonding. In the invention, a conductive submount substrate is provided. A first light emitter is bonded onto the conductive submount substrate by a metal layer. In the first light emitter, a p-type nitride semiconductor layer, a first active layer, an n-type nitride semiconductor layer and a conductive substrate are stacked sequentially from bottom to top. In addition, a second light emitter is formed on a partial area of the conductive substrate. In the second light emitter, a p-type AlGaInP-based semiconductor layer, an active layer and an n-type AlGaInP-based semiconductor layer are stacked sequentially from bottom to top. Further, a p-electrode is formed on an underside of the conductive submount substrate and an n-electrode is formed on a top surface of the n-type AlGaInP-based semiconductor layer.
21 Citations
21 Claims
-
1-13. -13. (canceled)
-
14. A white light emitting device comprising:
-
a submount substrate having a p-side lead terminal and an n-side lead terminal formed thereon; a first light emitter including a p-type nitride semiconductor layer, a first active layer, an n-type semiconductor layer and an insulating substrate stacked sequentially from bottom to top, the p-type semiconductor layer connected to the p-side lead terminal and the n-type semiconductor layer connected to the n-side lead terminal; a metal layer formed on a partial area of the insulating substrate; a second light emitter formed on the metal layer, bonded to a partial area of the metal layer, the second light emitter including a p-type AlGaInP-based semiconductor layer, a second active layer and an n-type AlGaInP-based semiconductor layer stacked sequentially; and a first p- and n-electrodes connected to the p- and n-type nitride semiconductor layers of the first light emitter, respectively; a second p-electrode connected to another area of the metal layer of the second light emitter; and a second n-electrode connected to the second AlGaInP-based semiconductor layer of the second light emitter. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
-
Specification