SURFACE MOUNT CAPACITOR USED AS A SUBSTRATE FLIP-CHIP CARRIER IN A RADIO FREQUENCY IDENTIFICATION TAG

• US 20090174527A1
• Filed: 01/09/2009
• Published: 07/09/2009
• Est. Priority Date: 01/09/2008
• Status: Abandoned Application

• Current Assignee: Allflex USA Incorporated (Merck & Co., Inc.)
• Original Assignee: Allflex USA Incorporated (Merck & Co., Inc.)
• Inventors: Stewart, Robert
• Application Number:
  US12/351,520
• Publication Number:
  US 20090174527A1
• Time in Patent Office: Days
• US Class Current: 340/10.100
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item

Abstract

In a passive radio frequency identification (RFID) transponder comprising an integrated circuit, an antenna coil, and at least one surface mount capacitor, a configuration is disclosed in which the surface mount capacitor is used as the integrated circuit carrier. The integrated circuit comprises a bumped die flip-chip, and the surface mount capacitor substrate has electrically conductive contacts and connections for electrically joining the antenna coil, capacitor, and integrated circuit. Transponders in accordance with embodiments of the invention do not include an intermediate substrate carrier onto which the capacitor and integrated circuit are mounted and interconnected, and to which the antenna coil is subsequently attached.

Claims

1. A transponder, comprising:

a capacitor having at least two terminals, where circuit traces are formed on at least one surface of the capacitor and connect to the terminals;

an integrated circuit mounted to a surface of the capacitor and including a plurality of contacts connected to the circuit traces formed on the capacitor; and

an antenna coil including two antenna leads that are connected at contact points to the circuit traces formed on the capacitor;

wherein the circuit traces connect at least two of the terminals of the capacitor to at least two of the contacts of the integrated circuit;

wherein the circuit traces connect the two antenna leads to at least two of the contacts of the integrated circuit; and

wherein the integrated circuit includes circuitry capable of generating an identification code signal in response to receipt of an activation signal by via the antenna coil.

2. The transponder of claim 1, wherein the capacitor includes a ceramic layer and the circuit traces are formed on the surface of the ceramic layer.

3. The transponder of claim 2, wherein the integrated circuit is mounted to the surface of the ceramic layer of the capacitor.

4. The transponder of claim 2, wherein the capacitor is a Multi-Layer Chip Capacitor.

5. The transponder of claim 1, wherein the circuitry of the integrated circuit includes an integrated resonant capacitor.

6. The transponder of claim 1, further comprising:

a resonant capacitor including two contacts mounted to the surface of said capacitor, where the terminals of the resonant capacitor are connected to the circuit traces formed on said capacitor;

wherein the circuit traces connect the resonant capacitor in parallel with the antenna leads.

7. The transponder of claim 1, wherein the circuit traces formed on at least one surface of the capacitor are patterns of electrically conductive material formed directly on the surface of the capacitor.

8. The transponder of claim 1, wherein the circuit traces formed on at least one surface of the capacitor further comprise an intermediate film substrate on which patterns of electrically conductive material are formed, where the intermediate film substrate is bonded to at least one surface of the capacitor.

9. The transponder of claim 1, wherein the contacts of the integrated circuit are bumped contacts.

10. The transponder of claim 1, further comprising an encapsulant that encapsulates the integrated circuit and bonds the integrated circuit to the capacitor.

11. The transponder of claim 1, wherein the capacitor is a two element capacitor that includes a charge capacitor having two terminals and a tuning capacitor having two terminals manufactured in a monolithic package.

12. A method of manufacturing a transponder assembly, comprising:

forming circuit traces on a ceramic surface of a capacitor;

aligning an integrated circuit including contacts with respect to the circuit traces formed on the ceramic surface; and

mounting the integrated circuit to the ceramic surface of the capacitor.

13. The method of claim 12, wherein the capacitor is a multi-layer chip capacitor and the circuits are screened onto the ceramic surface of the capacitor using thick film processing techniques.

14. The method of claim 13, wherein the integrated circuit is a die that includes contact pads that is prepared for mounting to the ceramic surface of the capacitor by bumping the contacts of the integrated circuit.

15. The method of claim 14, wherein mounting the integrated circuit further comprises reflowing the bumps on the contacts of the integrated circuit.

16. The method of claim 15, further comprising dispensing an underfill adjacent the integrated circuit and curing the underfill.

17. A method of manufacturing a transponder comprising:

forming circuit traces on a ceramic surface of a capacitor;

aligning an integrated circuit including contacts with respect to the circuit traces formed on the ceramic surface;

mounting the integrated circuit to the ceramic surface of the capacitor; and

connecting antenna leads at contact points to the circuit traces formed on the surface of the capacitor.

18. The method of claim 17, further comprising encapsulating the capacitor, the integrated circuit and the antenna.